Datasheets
59628961413QXX by: Cypress Semiconductor

128KX8 UVPROM, 70ns, CDIP32, CERAMIC, DIP-32

Part Details for 59628961413QXX by Cypress Semiconductor

Overview of 59628961413QXX by Cypress Semiconductor

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Applications Education and Research Internet of Things (IoT) Computing and Data Storage Aerospace and Defense Healthcare Telecommunications Automotive

Part Details for 59628961413QXX

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59628961413QXX Part Data Attributes

59628961413QXX Cypress Semiconductor
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59628961413QXX Cypress Semiconductor 128KX8 UVPROM, 70ns, CDIP32, CERAMIC, DIP-32
Part Life Cycle Code Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP
Part Package Code DIP
Package Description DIP, DIP32,.6
Pin Count 32
Reach Compliance Code unknown
ECCN Code 3A001.A.2.C
HTS Code 8542.32.00.61
Access Time-Max 70 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T32
JESD-609 Code e0
Memory Density 1048576 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 32
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Organization 128KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code DIP
Package Equivalence Code DIP32,.6
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Screening Level MIL-PRF-38535 Class Q
Standby Current-Max 0.025 A
Supply Current-Max 0.06 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade MILITARY
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL

Alternate Parts for 59628961413QXX

This table gives cross-reference parts and alternative options found for 59628961413QXX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of 59628961413QXX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
CY27C010-70WMB UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 Rochester Electronics LLC 59628961413QXX vs CY27C010-70WMB
5962-8961413QXX UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 Cypress Semiconductor 59628961413QXX vs 5962-8961413QXX
FT27C010-70DI UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIL-32 Force Technologies Ltd 59628961413QXX vs FT27C010-70DI
5962-8961413MXA UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 QP Semiconductor 59628961413QXX vs 5962-8961413MXA
5962-8961408MXA UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 Teledyne e2v 59628961413QXX vs 5962-8961408MXA
CY27C010-70WMB UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 Cypress Semiconductor 59628961413QXX vs CY27C010-70WMB
FT27C010-70DC UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIL-32 Force Technologies Ltd 59628961413QXX vs FT27C010-70DC
27CX010W-70 UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Integrated Circuit Technology Corp 59628961413QXX vs 27CX010W-70
WS57C010F-70DMB UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, CERAMIC, DIP-32 Teledyne e2v 59628961413QXX vs WS57C010F-70DMB
WS57C010F-70D UVPROM, 128KX8, 70ns, CMOS, CDIP32, Waferscale Integration Inc 59628961413QXX vs WS57C010F-70D
Part Number Description Manufacturer Compare
5962-8961413MXX UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 Teledyne e2v 59628961413QXX vs 5962-8961413MXX
FM27C010Q70 UVPROM, 128KX8, 70ns, CMOS, CDIP32, WINDOWED, CERDIP-32 Fairchild Semiconductor Corporation 59628961413QXX vs FM27C010Q70
AM27C010-70DI UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion 59628961413QXX vs AM27C010-70DI
AM27C010-70DCB UVPROM, 128KX8, 70ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion 59628961413QXX vs AM27C010-70DCB
AM27H010-70DCB UVPROM, 128KX8, 70ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD 59628961413QXX vs AM27H010-70DCB
IS27HC010-70CWI UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Integrated Silicon Solution Inc 59628961413QXX vs IS27HC010-70CWI
CY27C010-70WMB UVPROM, 128KX8, 70ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, HERMETIC SEALED, CERDIP-32 Rochester Electronics LLC 59628961413QXX vs CY27C010-70WMB
AM27H010-70DE UVPROM, 128KX8, 70ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD 59628961413QXX vs AM27H010-70DE
AM27H010-70DC UVPROM, 128KX8, 70ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD 59628961413QXX vs AM27H010-70DC
AM27H010-70DIB UVPROM, 128KX8, 70ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD 59628961413QXX vs AM27H010-70DIB

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