Part Details for W3E232M16S-200STIG by Microsemi Corporation
Overview of W3E232M16S-200STIG by Microsemi Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (8 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (8 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for W3E232M16S-200STIG
W3E232M16S-200STIG CAD Models
W3E232M16S-200STIG Part Data Attributes
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W3E232M16S-200STIG
Microsemi Corporation
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Datasheet
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W3E232M16S-200STIG
Microsemi Corporation
DDR DRAM, 64MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | TSOP2 | |
| Package Description | ATSOP, | |
| Pin Count | 66 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.32 | |
| Access Mode | MULTI BANK PAGE BURST | |
| Access Time-Max | 0.7 ns | |
| Additional Feature | AUTO/SELF REFRESH | |
| JESD-30 Code | R-PDSO-G66 | |
| Length | 22.352 mm | |
| Memory Density | 1073741824 bit | |
| Memory IC Type | DDR DRAM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Ports | 1 | |
| Number of Terminals | 66 | |
| Number of Words | 67108864 words | |
| Number of Words Code | 64000000 | |
| Operating Mode | SYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | ATSOP | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, PIGGYBACK, THIN PROFILE | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.794 mm | |
| Self Refresh | YES | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 12.319 mm |
Alternate Parts for W3E232M16S-200STIG
This table gives cross-reference parts and alternative options found for W3E232M16S-200STIG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W3E232M16S-200STIG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W3E232M16S-250STCG | DDR DRAM, 64MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 | Microsemi Corporation | W3E232M16S-200STIG vs W3E232M16S-250STCG |
| W3E232M16S-250STI | DDR DRAM, 64MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | Microsemi Corporation | W3E232M16S-200STIG vs W3E232M16S-250STI |
| W3E232M16S-266STIG | DDR DRAM, 64MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 | Microsemi Corporation | W3E232M16S-200STIG vs W3E232M16S-266STIG |
| W3E232M16S-266STI | DDR DRAM, 64MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | Microsemi Corporation | W3E232M16S-200STIG vs W3E232M16S-266STI |
| W3E232M16S-200STCG | DDR DRAM, 64MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 | Microsemi Corporation | W3E232M16S-200STIG vs W3E232M16S-200STCG |
| W3E232M16S-266STCG | DDR DRAM, 64MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 | Microsemi Corporation | W3E232M16S-200STIG vs W3E232M16S-266STCG |
| W3E232M16S-250STIG | DDR DRAM, 64MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, ROHS COMPLIANT, TSOP2-66 | Microsemi Corporation | W3E232M16S-200STIG vs W3E232M16S-250STIG |
| W3E232M16S-266STC | DDR DRAM, 64MX16, 0.7ns, CMOS, PDSO66, 0.400 X 0.875 INCH, 0.65 MM PITCH, TSOP2-66 | Microsemi Corporation | W3E232M16S-200STIG vs W3E232M16S-266STC |