W3E232M16S-200STIG vs W3E232M16S-250STCG feature comparison

W3E232M16S-200STIG Microsemi Corporation

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W3E232M16S-250STCG Microsemi Corporation

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Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICROSEMI CORP MICROSEMI CORP
Part Package Code TSOP2 TSOP2
Package Description ATSOP, ATSOP,
Pin Count 66 66
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.32 8542.32.00.32
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Access Time-Max 0.7 ns 0.7 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PDSO-G66 R-PDSO-G66
Length 22.352 mm 22.352 mm
Memory Density 1073741824 bit 1073741824 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 66 66
Number of Words 67108864 words 67108864 words
Number of Words Code 64000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min -40 °C
Organization 64MX16 64MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code ATSOP ATSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, PIGGYBACK, THIN PROFILE SMALL OUTLINE, PIGGYBACK, THIN PROFILE
Peak Reflow Temperature (Cel) NOT SPECIFIED NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.794 mm 2.794 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 2.7 V 2.7 V
Supply Voltage-Min (Vsup) 2.3 V 2.3 V
Supply Voltage-Nom (Vsup) 2.5 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL COMMERCIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 12.319 mm 12.319 mm
Base Number Matches 1 1

Compare W3E232M16S-200STIG with alternatives

Compare W3E232M16S-250STCG with alternatives