Datasheets
W27C512-45Z by: Winbond Electronics Corp

EEPROM, 64KX8, 45ns, Parallel, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28

Part Details for W27C512-45Z by Winbond Electronics Corp

Overview of W27C512-45Z by Winbond Electronics Corp

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Applications Industrial Automation

Part Details for W27C512-45Z

W27C512-45Z CAD Models

W27C512-45Z Part Data Attributes:

W27C512-45Z Winbond Electronics Corp
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W27C512-45Z Winbond Electronics Corp EEPROM, 64KX8, 45ns, Parallel, CMOS, PDIP28, 0.600 INCH, LEAD FREE, PLASTIC, DIP-28
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Package Code DIP
Package Description 0.600 INCH, LEAD FREE, PLASTIC, DIP-28
Pin Count 28
Reach Compliance Code compliant
ECCN Code 3A991.B.1.B.2
HTS Code 8542.32.00.51
Samacsys Manufacturer Winbond
Access Time-Max 45 ns
JESD-30 Code R-PDIP-T28
Length 37.08 mm
Memory Density 524288 bit
Memory IC Type EEPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 65536 words
Number of Words Code 64000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 64KX8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 12 V
Qualification Status Not Qualified
Seated Height-Max 5.33 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Alternate Parts for W27C512-45Z

This table gives cross-reference parts and alternative options found for W27C512-45Z. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W27C512-45Z, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
W27E512-45 EEPROM, 64KX8, 45ns, Parallel, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Winbond Electronics Corp W27C512-45Z vs W27E512-45
Part Number Description Manufacturer Compare
AT27C256R-90TI OTP ROM, 32KX8, 90ns, CMOS, PDSO28, PLASTIC, TSOP-28 Atmel Corporation W27C512-45Z vs AT27C256R-90TI
5962-8751413XA EEPROM, 8KX8, 350ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Pyramid Semiconductor Corporation W27C512-45Z vs 5962-8751413XA
MX29GL640EBTI-70G Flash, 4MX16, 70ns, PDSO48, 12 X 20 MM, HALOGEN FREE AND ROHS COMPLIANT, MO-142, TSOP-48 Macronix International Co Ltd W27C512-45Z vs MX29GL640EBTI-70G
WMF512K8-120FEC5 Flash, 512KX8, 120ns, CDFP32, CERAMIC, DFP-32 Mercury Systems Inc W27C512-45Z vs WMF512K8-120FEC5
WMF512K8-60DEQ5 Flash, 512KX8, 60ns, CDSO32, 0.400 INCH, HERMETIC SEALED, CERAMIC, SOJ-32 Mercury Systems Inc W27C512-45Z vs WMF512K8-60DEQ5
WMF512K8-120FEQ5A Flash, 512KX8, 120ns, CDFP32, CERAMIC, DFP-32 Mercury Systems Inc W27C512-45Z vs WMF512K8-120FEQ5A
AT27C512R-55TI OTP ROM, 64KX8, 55ns, CMOS, PDSO28, PLASTIC, TSOP-28 Atmel Corporation W27C512-45Z vs AT27C512R-55TI
LH28F800SGHB-L10 Flash, 512KX16, 100ns, PBGA48, 8 X 8 MM, FBGA-48 Sharp Corp W27C512-45Z vs LH28F800SGHB-L10
WMF512K8-70CQ5A Flash, 512KX8, 70ns, CDIP32, 0.600 INCH, HERMETIC SEALED, SINGLE CAVITY, CERAMIC, SDIP-32 Mercury Systems Inc W27C512-45Z vs WMF512K8-70CQ5A
5962-8751414XC EEPROM, 8KX8, 300ns, Parallel, CMOS, CDIP28, 0.600 INCH, CERDIP-28 Atmel Corporation W27C512-45Z vs 5962-8751414XC

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