Datasheets
W26B021T10LE by: Winbond Electronics Corp

Standard SRAM, 128KX16, 100ns, CMOS, PDSO48, TSOP1-48

Part Details for W26B021T10LE by Winbond Electronics Corp

Overview of W26B021T10LE by Winbond Electronics Corp

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Part Details for W26B021T10LE

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W26B021T10LE Part Data Attributes:

W26B021T10LE Winbond Electronics Corp
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W26B021T10LE Winbond Electronics Corp Standard SRAM, 128KX16, 100ns, CMOS, PDSO48, TSOP1-48
Part Life Cycle Code Obsolete
Ihs Manufacturer WINBOND ELECTRONICS CORP
Part Package Code TSOP1
Package Description TSOP1, TSSOP48,.71,20
Pin Count 48
Reach Compliance Code unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 100 ns
I/O Type COMMON
JESD-30 Code R-PDSO-G48
JESD-609 Code e3
Length 16.4 mm
Memory Density 2097152 bit
Memory IC Type STANDARD SRAM
Memory Width 16
Number of Functions 1
Number of Terminals 48
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -20 °C
Organization 128KX16
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY
Package Code TSOP1
Package Equivalence Code TSSOP48,.71,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 1.2 mm
Standby Voltage-Min 1.5 V
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2.2 V
Supply Voltage-Nom (Vsup) 3 V
Surface Mount YES
Technology CMOS
Temperature Grade OTHER
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position DUAL
Width 12 mm

Alternate Parts for W26B021T10LE

This table gives cross-reference parts and alternative options found for W26B021T10LE. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W26B021T10LE, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
UPD442012AGY-DD85X-MJH Standard SRAM, 128KX16, 85ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48 NEC Electronics America Inc W26B021T10LE vs UPD442012AGY-DD85X-MJH
UPD442012AGY-BB70X-MJH Standard SRAM, 128KX16, 70ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48 NEC Electronics America Inc W26B021T10LE vs UPD442012AGY-BB70X-MJH
UPD442012AGY-BC85X-MJH-A Standard SRAM, 128KX16, 85ns, MOS, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 NEC Electronics Group W26B021T10LE vs UPD442012AGY-BC85X-MJH-A
TC55V200TR-10 IC 128K X 16 STANDARD SRAM, 100 ns, PDSO48, 12 X 14 MM, 0.50 MM PITCH, PLASTIC, REVERSE, TSOP1-48, Static RAM Toshiba America Electronic Components W26B021T10LE vs TC55V200TR-10
UPD442012AGY-BC70X-MJH Standard SRAM, 128KX16, 70ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48 NEC Electronics America Inc W26B021T10LE vs UPD442012AGY-BC70X-MJH
UPD442012AGY-BB85X-MJH Standard SRAM, 128KX16, 85ns, CMOS, PDSO48, 12 X 18 MM, PLASTIC, TSOP1-48 NEC Electronics America Inc W26B021T10LE vs UPD442012AGY-BB85X-MJH
UPD442012AGY-BC10X-MJH-A Standard SRAM, 128KX16, 100ns, MOS, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 NEC Electronics Group W26B021T10LE vs UPD442012AGY-BC10X-MJH-A
TC55V200TR-70 IC 128K X 16 STANDARD SRAM, 70 ns, PDSO48, 12 X 14 MM, 0.50 MM PITCH, PLASTIC, REVERSE, TSOP1-48, Static RAM Toshiba America Electronic Components W26B021T10LE vs TC55V200TR-70
UPD442012AGY-DD10X-MJH-A 128KX16 STANDARD SRAM, 100ns, PDSO48, 12 X 18 MM, LEAD FREE, PLASTIC, TSOP1-48 Renesas Electronics Corporation W26B021T10LE vs UPD442012AGY-DD10X-MJH-A
W26B021T70LE Standard SRAM, 128KX16, 70ns, CMOS, PDSO48, TSOP1-48 Winbond Electronics Corp W26B021T10LE vs W26B021T70LE

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