There are no models available for this part yet.
Overview of W25Q128BVEAG by Winbond Electronics Corp
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 2 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
CAD Models for W25Q128BVEAG by Winbond Electronics Corp
Part Data Attributes for W25Q128BVEAG by Winbond Electronics Corp
|
|
|
|---|---|
|
Rohs Code
|
Yes
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
WINBOND ELECTRONICS CORP
|
|
Part Package Code
|
SON
|
|
Package Description
|
8 X 6 MM, GREEN, WSON-8
|
|
Pin Count
|
8
|
|
Reach Compliance Code
|
compliant
|
|
ECCN Code
|
EAR99
|
|
HTS Code
|
8542.32.00.51
|
|
Clock Frequency-Max (fCLK)
|
104 MHz
|
|
Data Retention Time-Min
|
20
|
|
Endurance
|
100000 Write/Erase Cycles
|
|
JESD-30 Code
|
R-PDSO-N8
|
|
Length
|
8 mm
|
|
Memory Density
|
134217728 bit
|
|
Memory IC Type
|
FLASH
|
|
Memory Width
|
8
|
|
Number of Functions
|
1
|
|
Number of Terminals
|
8
|
|
Number of Words
|
16777216 words
|
|
Number of Words Code
|
16000000
|
|
Operating Mode
|
SYNCHRONOUS
|
|
Operating Temperature-Max
|
105 °C
|
|
Operating Temperature-Min
|
-40 °C
|
|
Organization
|
16MX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
HVSON
|
|
Package Equivalence Code
|
SOLCC8,.3
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
|
Parallel/Serial
|
SERIAL
|
|
Programming Voltage
|
3 V
|
|
Qualification Status
|
Not Qualified
|
|
Seated Height-Max
|
0.8 mm
|
|
Serial Bus Type
|
SPI
|
|
Standby Current-Max
|
0.000015 A
|
|
Supply Current-Max
|
0.025 mA
|
|
Supply Voltage-Max (Vsup)
|
3.6 V
|
|
Supply Voltage-Min (Vsup)
|
2.7 V
|
|
Supply Voltage-Nom (Vsup)
|
3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
INDUSTRIAL
|
|
Terminal Form
|
NO LEAD
|
|
Terminal Pitch
|
1.27 mm
|
|
Terminal Position
|
DUAL
|
|
Type
|
NOR TYPE
|
|
Width
|
6 mm
|
|
Write Protection
|
HARDWARE/SOFTWARE
|
Alternate Parts for W25Q128BVEAG
This table gives cross-reference parts and alternative options found for W25Q128BVEAG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of W25Q128BVEAG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| W25Q128BVEBG | Flash, 16MX8, PDSO8, WSON-8 | Winbond Electronics Corp | W25Q128BVEAG vs W25Q128BVEBG |
| W25Q128FVEIG | Flash, 128MX1, PDSO8, WSON-8 | Winbond Electronics Corp | W25Q128BVEAG vs W25Q128FVEIG |