W25Q128BVEAG vs S25FL129P0XNFI001 feature comparison

W25Q128BVEAG Winbond Electronics Corp

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S25FL129P0XNFI001 Spansion

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer WINBOND ELECTRONICS CORP SPANSION INC
Part Package Code SON SON
Package Description 8 X 6 MM, GREEN, WSON-8 6 X 8 MM, LEAD FREE, PLASTIC, WSON-8
Pin Count 8 8
Reach Compliance Code compliant unknown
ECCN Code EAR99 3A991.B.1.A
HTS Code 8542.32.00.51 8542.32.00.51
Clock Frequency-Max (fCLK) 104 MHz 104 MHz
Data Retention Time-Min 20 20
Endurance 100000 Write/Erase Cycles 100000 Write/Erase Cycles
JESD-30 Code R-PDSO-N8 R-PDSO-N8
Length 8 mm 8 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type FLASH FLASH
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 8 8
Number of Words 16777216 words 16777216 words
Number of Words Code 16000000 16000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 105 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Organization 16MX8 16MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HVSON HVSON
Package Equivalence Code SOLCC8,.3 SOLCC8,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
Parallel/Serial SERIAL SERIAL
Programming Voltage 3 V 3 V
Qualification Status Not Qualified Not Qualified
Seated Height-Max 0.8 mm 0.8 mm
Serial Bus Type SPI SPI
Standby Current-Max 0.000015 A 0.00001 A
Supply Current-Max 0.025 mA 0.038 mA
Supply Voltage-Max (Vsup) 3.6 V 3.3 V
Supply Voltage-Min (Vsup) 2.7 V 2.7 V
Supply Voltage-Nom (Vsup) 3 V 3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form NO LEAD NO LEAD
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Type NOR TYPE NOR TYPE
Width 6 mm 6 mm
Write Protection HARDWARE/SOFTWARE HARDWARE/SOFTWARE
Base Number Matches 1 1
Pbfree Code Yes
JESD-609 Code e3
Moisture Sensitivity Level 3
Peak Reflow Temperature (Cel) 260
Terminal Finish MATTE TIN
Time@Peak Reflow Temperature-Max (s) 40
Write Cycle Time-Max (tWC) 50 ms

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