-
Part Symbol
-
Footprint
-
3D Model
Available Download Formats
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
Part Details for UPD70F3102AF1-33-FAA-A by Renesas Electronics Corporation
Overview of UPD70F3102AF1-33-FAA-A by Renesas Electronics Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Aerospace and Defense
Transportation and Logistics
Agriculture Technology
Automotive
Robotics and Drones
Part Details for UPD70F3102AF1-33-FAA-A
UPD70F3102AF1-33-FAA-A CAD Models
UPD70F3102AF1-33-FAA-A Part Data Attributes:
|
|
UPD70F3102AF1-33-FAA-A
Renesas Electronics Corporation
Buy Now
Datasheet
|
Compare Parts:
UPD70F3102AF1-33-FAA-A
Renesas Electronics Corporation
32-bit Microcontrollers (Non Promotion), LFBGA, /
|
| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | RENESAS ELECTRONICS CORP | |
| Part Package Code | LFBGA | |
| Package Description | LFBGA, BGA157,16X16,32 | |
| Pin Count | 157 | |
| Manufacturer Package Code | PLBG0157GB | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Samacsys Manufacturer | Renesas Electronics | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| CPU Family | V850 | |
| Clock Frequency-Max | 33 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PBGA-B157 | |
| JESD-609 Code | e6 | |
| Length | 14 mm | |
| Moisture Sensitivity Level | 4 | |
| Number of I/O Lines | 123 | |
| Number of Terminals | 157 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | NO | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA157,16X16,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 4096 | |
| ROM (words) | 131072 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.46 mm | |
| Speed | 33 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | MOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | TIN BISMUTH | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 10 | |
| Width | 14 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |