Datasheets
U630H64BDC25 by:

Non-Volatile SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28

Part Details for U630H64BDC25 by ZMDI

Overview of U630H64BDC25 by ZMDI

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Applications Energy and Power Systems Transportation and Logistics Renewable Energy Automotive

Part Details for U630H64BDC25

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U630H64BDC25 Part Data Attributes:

U630H64BDC25 ZMDI
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U630H64BDC25 ZMDI Non-Volatile SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ZENTRUM MIKROELEKTRONIK DRESDEN AG
Part Package Code DIP
Package Description DIP, DIP28,.3
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.41
Access Time-Max 25 ns
JESD-30 Code R-PDIP-T28
JESD-609 Code e0
Length 34.7 mm
Memory Density 65536 bit
Memory IC Type NON-VOLATILE SRAM
Memory Width 8
Moisture Sensitivity Level 3
Number of Functions 1
Number of Ports 1
Number of Terminals 28
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 8KX8
Output Characteristics 3-STATE
Output Enable YES
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP28,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Seated Height-Max 5.1 mm
Standby Current-Max 0.001 A
Supply Current-Max 0.09 mA
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Width 7.62 mm

Alternate Parts for U630H64BDC25

This table gives cross-reference parts and alternative options found for U630H64BDC25. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of U630H64BDC25, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
U632H64DC25G1 Non-Volatile SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, LEAD FREE, PLASTIC, DIP-28 ZMDI U630H64BDC25 vs U632H64DC25G1
U632H64DK25 Non-Volatile SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Simtek Corporation U630H64BDC25 vs U632H64DK25
U632H64DC25 Non-Volatile SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 ZMDI U630H64BDC25 vs U632H64DC25
STK10C68-5C25 Non-Volatile SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Simtek Corporation U630H64BDC25 vs STK10C68-5C25
U632H64BDC25 Non-Volatile SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Simtek Corporation U630H64BDC25 vs U632H64BDC25
STK10C68-PF25 8KX8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Cypress Semiconductor U630H64BDC25 vs STK10C68-PF25
U632H64BDK25G1 Non-Volatile SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, LEAD FREE, PLASTIC, DIP-28 ZMDI U630H64BDC25 vs U632H64BDK25G1
STK11C68-K25 Non-Volatile SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Simtek Corporation U630H64BDC25 vs STK11C68-K25
STK10C68-C25I 8KX8 NON-VOLATILE SRAM, 25ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Cypress Semiconductor U630H64BDC25 vs STK10C68-C25I
STK10C68-5C25I 8KX8 NON-VOLATILE SRAM, 25ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Cypress Semiconductor U630H64BDC25 vs STK10C68-5C25I
Part Number Description Manufacturer Compare
STK12C68-K25IM 8KX8 NON-VOLATILE SRAM, 25ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Cypress Semiconductor U630H64BDC25 vs STK12C68-K25IM
STK12C68-K25 8KX8 NON-VOLATILE SRAM, 25ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Cypress Semiconductor U630H64BDC25 vs STK12C68-K25
U631H64BDC25 8KX8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Cypress Semiconductor U630H64BDC25 vs U631H64BDC25
U631H64BDK25 Non-Volatile SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 ZMDI U630H64BDC25 vs U631H64BDK25
STK10C68-PF25 Non-Volatile SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Simtek Corporation U630H64BDC25 vs STK10C68-PF25
STK11C68-PF25 Non-Volatile SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Simtek Corporation U630H64BDC25 vs STK11C68-PF25
U632H64BDK25G1 Non-Volatile SRAM, 8KX8, 25ns, CMOS, PDIP28, 0.300 INCH, LEAD FREE, PLASTIC, DIP-28 Simtek Corporation U630H64BDC25 vs U632H64BDK25G1
STK10C68-K25 8KX8 NON-VOLATILE SRAM, 25ns, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Cypress Semiconductor U630H64BDC25 vs STK10C68-K25
STK10C68-P25 8KX8 NON-VOLATILE SRAM, 25ns, PDIP28, 0.300 INCH, PLASTIC, DIP-28 Cypress Semiconductor U630H64BDC25 vs STK10C68-P25
STK11C68-C25I Non-Volatile SRAM, 8KX8, 25ns, CMOS, CDIP28, 0.300 INCH, CERAMIC, DIP-28 Simtek Corporation U630H64BDC25 vs STK11C68-C25I

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