Part Details for TSPC860SRVZP50D by Atmel Corporation
Overview of TSPC860SRVZP50D by Atmel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC860SRVZP50D
TSPC860SRVZP50D CAD Models
TSPC860SRVZP50D Part Data Attributes:
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TSPC860SRVZP50D
Atmel Corporation
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Datasheet
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TSPC860SRVZP50D
Atmel Corporation
RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | ATMEL CORP | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA357,19X19,50 | |
| Pin Count | 357 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 50 MHz | |
| External Data Bus Width | 32 | |
| Format | FIXED POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-PBGA-B357 | |
| JESD-609 Code | e0 | |
| Length | 25 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 357 | |
| Operating Temperature-Max | 110 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Equivalence Code | BGA357,19X19,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 2.05 mm | |
| Speed | 50 MHz | |
| Supply Voltage-Max | 3.465 V | |
| Supply Voltage-Min | 3.135 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 25 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC860SRVZP50D
This table gives cross-reference parts and alternative options found for TSPC860SRVZP50D. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC860SRVZP50D, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSXPC860MHVZPU50C1 | RISC Microprocessor, 32-Bit, 50MHz, PBGA357 | Microchip Technology Inc | TSPC860SRVZP50D vs TSXPC860MHVZPU50C1 |
| MPC855TVR50D4 | PowerQUICC, 32 Bit Power Architecture SoC, 50MHz, CPM, ENET, ATM, HDLC, PCMCIA, 0 to 95C | Freescale Semiconductor | TSPC860SRVZP50D vs MPC855TVR50D4 |
| XPC860PZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSPC860SRVZP50D vs XPC860PZP50D3 |
| TSPC860SRMZP50D | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | e2v technologies | TSPC860SRVZP50D vs TSPC860SRMZP50D |
| XPC860DTZP50D3 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357, PLASTIC, BGA-357 | Motorola Mobility LLC | TSPC860SRVZP50D vs XPC860DTZP50D3 |
| TSXPC860SRMZPU50C1 | RISC Microprocessor, 32-Bit, 50MHz, CMOS, PBGA357, PLASTIC, BGA-357 | Atmel Corporation | TSPC860SRVZP50D vs TSXPC860SRMZPU50C1 |
| MPC860TCZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | TSPC860SRVZP50D vs MPC860TCZQ50D4 |
| MPC860PCZQ50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | TSPC860SRVZP50D vs MPC860PCZQ50D4 |
| XPC860DPZP50D4 | IC,COMMUNICATIONS CONTROLLER,BGA,357PIN | Freescale Semiconductor | TSPC860SRVZP50D vs XPC860DPZP50D4 |
| MPC855TVR50D4 | 32-BIT, 50MHz, RISC PROCESSOR, PBGA357 | NXP Semiconductors | TSPC860SRVZP50D vs MPC855TVR50D4 |