Datasheets
TSPC603RVGH8LC by:

RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255

Part Details for TSPC603RVGH8LC by Teledyne e2v

Overview of TSPC603RVGH8LC by Teledyne e2v

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Part Details for TSPC603RVGH8LC

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TSPC603RVGH8LC Part Data Attributes

TSPC603RVGH8LC Teledyne e2v
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TSPC603RVGH8LC Teledyne e2v RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255
Part Life Cycle Code Obsolete
Ihs Manufacturer TELEDYNE E2V (UK) LTD
Part Package Code BGA
Package Description 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCEBGA-255
Pin Count 255
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 32
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 200 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B255
Length 21 mm
Low Power Mode YES
Number of Terminals 255
Operating Temperature-Max 110 °C
Operating Temperature-Min -40 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Equivalence Code BGA255,16X16,50
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.08 mm
Speed 200 MHz
Supply Voltage-Max 2.625 V
Supply Voltage-Min 2.375 V
Supply Voltage-Nom 2.5 V
Surface Mount YES
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 21 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for TSPC603RVGH8LC

This table gives cross-reference parts and alternative options found for TSPC603RVGH8LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC603RVGH8LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
TSXPC603RMGU8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSXPC603RMGU8LC
TSPC603RVG8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSPC603RVG8LC
TSPC603RVGH8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSPC603RVGH8LC
TSPC603RMGU/T8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RMGU/T8LC
TSPC603RMGU8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RMGU8LC
TSPC603RMGU/T8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSPC603RMGU/T8LC
TSXPC603RMGU/T8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSXPC603RMGU/T8LC
TSXPC603RVGH8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.08 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSXPC603RVGH8LC
TSPC603RMGB/T8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RMGB/T8LC
TSPC603RVGU/T8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSPC603RVGU/T8LC
Part Number Description Manufacturer Compare
TSPC603RCAB/Q8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CQFP240, CERAMIC, QFP-240 Teledyne e2v TSPC603RVGH8LC vs TSPC603RCAB/Q8LC
XPC603PZT200TX 32-BIT, 200MHz, RISC PROCESSOR, PBGA255, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-255 Freescale Semiconductor TSPC603RVGH8LC vs XPC603PZT200TX
TSXPC603RMGU8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSXPC603RMGU8LC
TSPC603RMGSB/Q8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RMGSB/Q8LC
TSPC603RMGB/T8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Teledyne e2v TSPC603RVGH8LC vs TSPC603RMGB/T8LC
TSXPC603RVGS8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CI-CGA-255 Atmel Corporation TSPC603RVGH8LC vs TSXPC603RVGS8LC
TSXPC603RMYB/T8LC RISC Microprocessor, 32-Bit, 200MHz, CMOS, MQFP240, CAVITY UP, METAL, QFP-240 Atmel Corporation TSPC603RVGH8LC vs TSXPC603RMYB/T8LC
TSXPC603PMAU8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CQFP240, CERAMIC, QFP-240 Atmel Corporation TSPC603RVGH8LC vs TSXPC603PMAU8LE
TSPC603PMGB/Q8LE RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 Atmel Corporation TSPC603RVGH8LC vs TSPC603PMGB/Q8LE
XPC603PZT200LX 32-BIT, 200MHz, RISC PROCESSOR, PBGA255, 23 X 23 MM, 1.27 MM PITCH, PLASTIC, BGA-255 Freescale Semiconductor TSPC603RVGH8LC vs XPC603PZT200LX

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