Part Details for TSPC603RMGSB/Q8LC by Teledyne e2v
Overview of TSPC603RMGSB/Q8LC by Teledyne e2v
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for TSPC603RMGSB/Q8LC
TSPC603RMGSB/Q8LC CAD Models
TSPC603RMGSB/Q8LC Part Data Attributes
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TSPC603RMGSB/Q8LC
Teledyne e2v
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Datasheet
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TSPC603RMGSB/Q8LC
Teledyne e2v
RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | E2V TECHNOLOGIES PLC | |
| Part Package Code | BGA | |
| Package Description | BGA, BGA255,16X16,50 | |
| Pin Count | 255 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Address Bus Width | 32 | |
| Bit Size | 32 | |
| Boundary Scan | YES | |
| Clock Frequency-Max | 200 MHz | |
| External Data Bus Width | 64 | |
| Format | FLOATING POINT | |
| Integrated Cache | YES | |
| JESD-30 Code | S-CBGA-B255 | |
| Length | 21 mm | |
| Low Power Mode | YES | |
| Number of Terminals | 255 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | BGA | |
| Package Equivalence Code | BGA255,16X16,50 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY | |
| Qualification Status | Not Qualified | |
| Screening Level | MIL-PRF-38535 Class Q | |
| Seated Height-Max | 3.84 mm | |
| Speed | 200 MHz | |
| Supply Voltage-Max | 2.625 V | |
| Supply Voltage-Min | 2.375 V | |
| Supply Voltage-Nom | 2.5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | MILITARY | |
| Terminal Form | BALL | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | BOTTOM | |
| Width | 21 mm | |
| uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for TSPC603RMGSB/Q8LC
This table gives cross-reference parts and alternative options found for TSPC603RMGSB/Q8LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of TSPC603RMGSB/Q8LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| TSXPC603RMGSU8LC | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CI-CGA-255 | Atmel Corporation | TSPC603RMGSB/Q8LC vs TSXPC603RMGSU8LC |
| TSPC603RMGS8LC | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CI-CGA-255 | Atmel Corporation | TSPC603RMGSB/Q8LC vs TSPC603RMGS8LC |
| TSXPC603RVGSB/Q8LC | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CI-CGA-255 | Atmel Corporation | TSPC603RMGSB/Q8LC vs TSXPC603RVGSB/Q8LC |
| TSXPC603RVGS8LC | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CI-CGA-255 | Atmel Corporation | TSPC603RMGSB/Q8LC vs TSXPC603RVGS8LC |
| TSPC603RVGSB/Q8LC | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Teledyne e2v | TSPC603RMGSB/Q8LC vs TSPC603RVGSB/Q8LC |
| TSPC603RMGSB/T8LC | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CGA-255 | Atmel Corporation | TSPC603RMGSB/Q8LC vs TSPC603RMGSB/T8LC |
| TSXPC603RVGSU8LC | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CI-CGA-255 | Atmel Corporation | TSPC603RMGSB/Q8LC vs TSXPC603RVGSU8LC |
| TSPC603RVGS8LC | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CI-CGA-255 | Atmel Corporation | TSPC603RMGSB/Q8LC vs TSPC603RVGS8LC |
| TSPC603RMGSB/T8LC | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CGA-255 | Teledyne e2v | TSPC603RMGSB/Q8LC vs TSPC603RMGSB/T8LC |
| TSPC603RMGS8LC | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 3.84 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Teledyne e2v | TSPC603RMGSB/Q8LC vs TSPC603RMGS8LC |