Part Details for TMP94C251AF by Toshiba America Electronic Components
Overview of TMP94C251AF by Toshiba America Electronic Components
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for TMP94C251AF
TMP94C251AF CAD Models
TMP94C251AF Part Data Attributes:
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TMP94C251AF
Toshiba America Electronic Components
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Datasheet
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TMP94C251AF
Toshiba America Electronic Components
IC 32-BIT, 20 MHz, MICROCONTROLLER, PQFP144, 20 X 20 MM, 0.50 MM PITCH, PLASTIC, QFP-144, Microcontroller
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Part Package Code | QFP | |
| Package Description | FQFP, QFP144,.87SQ,20 | |
| Pin Count | 144 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.31.00.01 | |
| Has ADC | YES | |
| Address Bus Width | 24 | |
| Bit Size | 32 | |
| CPU Family | TLCS-900/H2 | |
| Clock Frequency-Max | 10 MHz | |
| DAC Channels | YES | |
| DMA Channels | YES | |
| External Data Bus Width | 16 | |
| JESD-30 Code | S-PQFP-G144 | |
| Length | 20 mm | |
| Number of I/O Lines | 64 | |
| Number of Terminals | 144 | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | -20 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | FQFP | |
| Package Equivalence Code | QFP144,.87SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | FLATPACK, FINE PITCH | |
| Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 2048 | |
| Seated Height-Max | 4.45 mm | |
| Speed | 20 MHz | |
| Supply Current-Max | 108 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 4.5 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 20 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER |