Part Details for TLD1211SJ by Infineon Technologies AG
Results Overview of TLD1211SJ by Infineon Technologies AG
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- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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TLD1211SJ Information
TLD1211SJ by Infineon Technologies AG is a Display Driver.
Display Drivers are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Part Details for TLD1211SJ
TLD1211SJ CAD Models
TLD1211SJ Part Data Attributes
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TLD1211SJ
Infineon Technologies AG
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Datasheet
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TLD1211SJ
Infineon Technologies AG
LED Driver, 1-Segment, BIPolar, PDSO8, GREEN, PLASTIC PACKAGE-8
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | INFINEON TECHNOLOGIES AG | |
| Part Package Code | SOIC | |
| Pin Count | 8 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | Infineon | |
| Interface IC Type | LED DISPLAY DRIVER | |
| JESD-30 Code | R-PDSO-G8 | |
| Length | 5 mm | |
| Moisture Sensitivity Level | 3 | |
| Multiplexed Display Capability | NO | |
| Number of Functions | 1 | |
| Number of Segments | 1 | |
| Number of Terminals | 8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | SOP | |
| Package Equivalence Code | SOP8,.25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Screening Level | AEC-Q100 | |
| Seated Height-Max | 1.75 mm | |
| Supply Voltage-Max | 28 V | |
| Supply Voltage-Min | 8 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Terminal Finish | Nickel/Gold/Palladium (Ni/Au/Pd) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
| Width | 4 mm |
TLD1211SJ Frequently Asked Questions (FAQ)
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A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or a heat sink to ensure good heat dissipation.
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Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout guidelines. Also, consider using a thermistor or thermal sensor to monitor the device temperature.
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The maximum allowed voltage on the input pins is 5.5V, but it's recommended to keep it below 5V to ensure reliable operation and prevent damage to the device.
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Yes, but ensure proper conformal coating and follow the recommended PCB assembly and handling guidelines to prevent moisture-related issues.
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Check the power supply voltage, ensure proper connections, and verify that the enable pin is properly configured. Also, check for any signs of physical damage or overheating.