Part Details for THGBMHG9C8LBAAG by Toshiba America Electronic Components
Overview of THGBMHG9C8LBAAG by Toshiba America Electronic Components
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Computing and Data Storage
Price & Stock for THGBMHG9C8LBAAG
| Part # | Distributor | Description | Stock | Price | Buy | |
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Win Source Electronics | Flash Card 64G-byte 3.3V Embedded MMC 153-Pin FBGA | 538 |
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$36.1120 / $54.1670 | Buy Now |
Part Details for THGBMHG9C8LBAAG
THGBMHG9C8LBAAG CAD Models
THGBMHG9C8LBAAG Part Data Attributes
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THGBMHG9C8LBAAG
Toshiba America Electronic Components
Buy Now
Datasheet
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THGBMHG9C8LBAAG
Toshiba America Electronic Components
Memory Circuit, 64GX8, CMOS
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | TOSHIBA CORP | |
| Package Description | PACKAGE | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Date Of Intro | 2017-06-23 | |
| JESD-30 Code | R-PBGA-B | |
| Memory Density | 549755813888 bit | |
| Memory IC Type | MEMORY CIRCUIT | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Words | 68719476736 words | |
| Number of Words Code | 64000000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 64GX8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Screening Level | AEC-Q100 | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Position | BOTTOM |