Part Details for TD62S312AFM by Toshiba America Electronic Components
Overview of TD62S312AFM by Toshiba America Electronic Components
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Part Details for TD62S312AFM
TD62S312AFM CAD Models
TD62S312AFM Part Data Attributes
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TD62S312AFM
Toshiba America Electronic Components
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Datasheet
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TD62S312AFM
Toshiba America Electronic Components
IC 0.1 A BUF OR INV BASED PRPHL DRVR, PDSO6, 3 X 3 MM, 0.95 MM PITCH, HEAT SINK, PLASTIC, SON-6, Peripheral Driver
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Part Life Cycle Code | Active | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | SON | |
Package Description | HVSON, SOLCC6,.13,38 | |
Pin Count | 6 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Built-in Protections | TRANSIENT | |
Driver Number of Bits | 1 | |
Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
JESD-30 Code | R-PDSO-N6 | |
JESD-609 Code | e0 | |
Length | 2.9 mm | |
Number of Functions | 1 | |
Number of Terminals | 6 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Current Flow Direction | SOURCE | |
Output Current-Max | 0.1 A | |
Output Peak Current Limit-Nom | 0.1 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HVSON | |
Package Equivalence Code | SOLCC6,.13,38 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.9 mm | |
Supply Voltage-Max | 50 V | |
Supply Voltage-Nom | 50 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN LEAD | |
Terminal Form | NO LEAD | |
Terminal Pitch | 0.95 mm | |
Terminal Position | DUAL | |
Width | 2.8 mm |