Part Details for TD62318AFG by Toshiba America Electronic Components
Overview of TD62318AFG by Toshiba America Electronic Components
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Part Details for TD62318AFG
TD62318AFG CAD Models
TD62318AFG Part Data Attributes
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TD62318AFG
Toshiba America Electronic Components
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Datasheet
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TD62318AFG
Toshiba America Electronic Components
IC 0.57 A BUF OR INV BASED PRPHL DRVR, PDSO16, 0.300 INCH, 1 MM PITCH, LEAD FREE, PLASTIC, HSOP-16, Peripheral Driver
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | TOSHIBA CORP | |
Part Package Code | SOIC | |
Package Description | HSSOP, SOP16/24,.37,40 | |
Pin Count | 16 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Built-in Protections | TRANSIENT | |
Driver Number of Bits | 4 | |
Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
JESD-30 Code | R-PDSO-G16 | |
Length | 13 mm | |
Number of Functions | 1 | |
Number of Terminals | 16 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Output Current Flow Direction | SINK | |
Output Current-Max | 0.7 A | |
Output Peak Current Limit-Nom | 0.57 A | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | HSSOP | |
Package Equivalence Code | SOP16/24,.37,40 | |
Package Shape | RECTANGULAR | |
Package Style | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Qualification Status | Not Qualified | |
Seated Height-Max | 2.85 mm | |
Supply Voltage-Max | 5.5 V | |
Supply Voltage-Min | 4.5 V | |
Supply Voltage-Nom | 5 V | |
Surface Mount | YES | |
Technology | BIPOLAR | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | GULL WING | |
Terminal Pitch | 1 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Turn-off Time | 16 µs | |
Turn-on Time | 0.8 µs | |
Width | 6.4 mm |