Part Details for SC900841JVK by Freescale Semiconductor
Overview of SC900841JVK by Freescale Semiconductor
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part Details for SC900841JVK
SC900841JVK CAD Models
SC900841JVK Part Data Attributes:
|
SC900841JVK
Freescale Semiconductor
Buy Now
Datasheet
|
Compare Parts:
SC900841JVK
Freescale Semiconductor
1-CHANNEL POWER SUPPLY MANAGEMENT CKT, PBGA338, 11 X 11 MM, ROHS COMPLIANT, PLASTIC, MABGA-338
|
Rohs Code | Yes | |
Part Life Cycle Code | Transferred | |
Ihs Manufacturer | FREESCALE SEMICONDUCTOR INC | |
Part Package Code | BGA | |
Package Description | TFBGA, | |
Pin Count | 338 | |
Reach Compliance Code | not_compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.39.00.01 | |
Adjustable Threshold | YES | |
Analog IC - Other Type | POWER SUPPLY MANAGEMENT CIRCUIT | |
JESD-30 Code | S-PBGA-B338 | |
Length | 11 mm | |
Moisture Sensitivity Level | 3 | |
Number of Channels | 1 | |
Number of Functions | 1 | |
Number of Terminals | 338 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | TFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 1.2 mm | |
Supply Voltage-Max (Vsup) | 4.4 V | |
Supply Voltage-Min (Vsup) | 3 V | |
Supply Voltage-Nom (Vsup) | 3.6 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER OVER NICKEL | |
Terminal Form | BALL | |
Terminal Pitch | 0.706 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 40 | |
Width | 11 mm |