Part Details for PCF8582C-2P by Philips Semiconductors
Overview of PCF8582C-2P by Philips Semiconductors
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- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Smart Cities
Part Details for PCF8582C-2P
PCF8582C-2P CAD Models
PCF8582C-2P Part Data Attributes:
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PCF8582C-2P
Philips Semiconductors
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Datasheet
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PCF8582C-2P
Philips Semiconductors
EEPROM, 256X8, Serial, CMOS, PDIP8,
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | PHILIPS SEMICONDUCTORS | |
| Package Description | DIP, DIP8,.3 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.51 | |
| Data Retention Time-Min | 10 | |
| Endurance | 100000 Write/Erase Cycles | |
| I2C Control Byte | 1010DDDR | |
| JESD-30 Code | R-PDIP-T8 | |
| JESD-609 Code | e4 | |
| Memory Density | 2048 bit | |
| Memory IC Type | EEPROM | |
| Memory Width | 8 | |
| Number of Terminals | 8 | |
| Number of Words | 256 words | |
| Number of Words Code | 256 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 256X8 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | DIP | |
| Package Equivalence Code | DIP8,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Parallel/Serial | SERIAL | |
| Qualification Status | Not Qualified | |
| Serial Bus Type | I2C | |
| Standby Current-Max | 0.0000035 A | |
| Supply Current-Max | 0.002 mA | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL |