Part Details for NMC27C16BQE200 by Fairchild Semiconductor Corporation
Overview of NMC27C16BQE200 by Fairchild Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (6 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (5 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Consumer Electronics
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Part Details for NMC27C16BQE200
NMC27C16BQE200 CAD Models
NMC27C16BQE200 Part Data Attributes
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NMC27C16BQE200
Fairchild Semiconductor Corporation
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Datasheet
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NMC27C16BQE200
Fairchild Semiconductor Corporation
UVPROM, 2KX8, 200ns, CMOS, CDIP24, WINDOWED, CERAMIC, DIP-24
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Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | FAIRCHILD SEMICONDUCTOR CORP | |
Part Package Code | DIP | |
Package Description | WDIP, DIP24,.6 | |
Pin Count | 24 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 200 ns | |
Additional Feature | TTL COMPATIBLE INPUTS/OUTPUTS | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T24 | |
JESD-609 Code | e0 | |
Memory Density | 16384 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 24 | |
Number of Words | 2048 words | |
Number of Words Code | 2000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 2KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP24,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.969 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.02 mA | |
Supply Voltage-Max (Vsup) | 5.5 V | |
Supply Voltage-Min (Vsup) | 4.5 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | Tin/Lead (Sn/Pb) | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Width | 15.24 mm |
Alternate Parts for NMC27C16BQE200
This table gives cross-reference parts and alternative options found for NMC27C16BQE200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NMC27C16BQE200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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NMC27C16BQ200 | IC 2K X 8 UVPROM, 200 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM | Texas Instruments | NMC27C16BQE200 vs NMC27C16BQ200 |
NMC27C16BQE200 | 2KX8 UVPROM, 200ns, CDIP24, CERAMIC, DIP-24 | Texas Instruments | NMC27C16BQE200 vs NMC27C16BQE200 |
AM2716B-200DI | UVPROM, 2KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C16BQE200 vs AM2716B-200DI |
AM2716B-200DE | UVPROM, 2KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C16BQE200 vs AM2716B-200DE |
AM2716B-200/BJA | UVPROM, 2KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C16BQE200 vs AM2716B-200/BJA |
AM2716B-205DI | UVPROM, 2KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | NMC27C16BQE200 vs AM2716B-205DI |