There are no models available for this part yet.
Overview of AM2716B-200/BJA by AMD
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 6 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 4 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
CAD Models for AM2716B-200/BJA by AMD
Part Data Attributes for AM2716B-200/BJA by AMD
|
|
|
|---|---|
|
Pbfree Code
|
No
|
|
Rohs Code
|
No
|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
ADVANCED MICRO DEVICES INC
|
|
Part Package Code
|
DIP
|
|
Package Description
|
WDIP, DIP24,.6
|
|
Pin Count
|
24
|
|
Reach Compliance Code
|
unknown
|
|
ECCN Code
|
3A001.A.2.C
|
|
HTS Code
|
8542.32.00.61
|
|
Access Time-Max
|
200 ns
|
|
I/O Type
|
COMMON
|
|
JESD-30 Code
|
R-GDIP-T24
|
|
JESD-609 Code
|
e0
|
|
Length
|
32.0675 mm
|
|
Memory Density
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16384 bit
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Memory IC Type
|
UVPROM
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|
Memory Width
|
8
|
|
Number of Functions
|
1
|
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Number of Terminals
|
24
|
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Number of Words
|
2048 words
|
|
Number of Words Code
|
2000
|
|
Operating Mode
|
ASYNCHRONOUS
|
|
Operating Temperature-Max
|
125 °C
|
|
Operating Temperature-Min
|
-55 °C
|
|
Organization
|
2KX8
|
|
Output Characteristics
|
3-STATE
|
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
|
Package Code
|
WDIP
|
|
Package Equivalence Code
|
DIP24,.6
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
IN-LINE, WINDOW
|
|
Parallel/Serial
|
PARALLEL
|
|
Programming Voltage
|
12.5 V
|
|
Qualification Status
|
Not Qualified
|
|
Screening Level
|
38535Q/M;38534H;883B
|
|
Seated Height-Max
|
5.588 mm
|
|
Supply Current-Max
|
0.1 mA
|
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
|
Supply Voltage-Nom (Vsup)
|
5 V
|
|
Surface Mount
|
NO
|
|
Technology
|
NMOS
|
|
Temperature Grade
|
MILITARY
|
|
Terminal Finish
|
TIN LEAD
|
|
Terminal Form
|
THROUGH-HOLE
|
|
Terminal Pitch
|
2.54 mm
|
|
Terminal Position
|
DUAL
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|
Width
|
15.24 mm
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Alternate Parts for AM2716B-200/BJA
This table gives cross-reference parts and alternative options found for AM2716B-200/BJA. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM2716B-200/BJA, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| NMC27C16BQ200 | IC 2K X 8 UVPROM, 200 ns, CDIP24, CERAMIC, DIP-24, Programmable ROM | Texas Instruments | AM2716B-200/BJA vs NMC27C16BQ200 |
| NMC27C16BQE200 | 2KX8 UVPROM, 200ns, CDIP24, CERAMIC, DIP-24 | Texas Instruments | AM2716B-200/BJA vs NMC27C16BQE200 |
| AM2716B-200DI | UVPROM, 2KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | AM2716B-200/BJA vs AM2716B-200DI |
| NMC27C16BQE200 | UVPROM, 2KX8, 200ns, CMOS, CDIP24, WINDOWED, CERAMIC, DIP-24 | Fairchild Semiconductor Corporation | AM2716B-200/BJA vs NMC27C16BQE200 |
| AM2716B-200DE | UVPROM, 2KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | AM2716B-200/BJA vs AM2716B-200DE |
| AM2716B-205DI | UVPROM, 2KX8, 200ns, NMOS, CDIP24, HERMETIC SEALED, CERAMIC, DIP-24 | AMD | AM2716B-200/BJA vs AM2716B-205DI |