There are no models available for this part yet.
Overview of NM27C010QE200 by Fairchild Semiconductor Corporation
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 10 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Computing and Data Storage
Financial Technology (Fintech)
Telecommunications
CAD Models for NM27C010QE200 by Fairchild Semiconductor Corporation
Part Data Attributes for NM27C010QE200 by Fairchild Semiconductor Corporation
|
|
---|---|
Pbfree Code
|
No
|
Rohs Code
|
No
|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
FAIRCHILD SEMICONDUCTOR CORP
|
Part Package Code
|
DIP
|
Package Description
|
WINDOWED, CERAMIC, DIP-32
|
Pin Count
|
32
|
Reach Compliance Code
|
compliant
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.61
|
Access Time-Max
|
200 ns
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-GDIP-T32
|
JESD-609 Code
|
e0
|
Memory Density
|
1048576 bit
|
Memory IC Type
|
UVPROM
|
Memory Width
|
8
|
Number of Functions
|
1
|
Number of Terminals
|
32
|
Number of Words
|
131072 words
|
Number of Words Code
|
128000
|
Operating Mode
|
ASYNCHRONOUS
|
Operating Temperature-Max
|
85 °C
|
Operating Temperature-Min
|
-40 °C
|
Organization
|
128KX8
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
CERAMIC, GLASS-SEALED
|
Package Code
|
WDIP
|
Package Equivalence Code
|
DIP32,.6
|
Package Shape
|
RECTANGULAR
|
Package Style
|
IN-LINE, WINDOW
|
Parallel/Serial
|
PARALLEL
|
Qualification Status
|
Not Qualified
|
Seated Height-Max
|
5.969 mm
|
Standby Current-Max
|
0.0001 A
|
Supply Current-Max
|
0.03 mA
|
Supply Voltage-Max (Vsup)
|
5.5 V
|
Supply Voltage-Min (Vsup)
|
4.5 V
|
Supply Voltage-Nom (Vsup)
|
5 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
INDUSTRIAL
|
Terminal Finish
|
TIN LEAD
|
Terminal Form
|
THROUGH-HOLE
|
Terminal Pitch
|
2.54 mm
|
Terminal Position
|
DUAL
|
Width
|
15.24 mm
|
Alternate Parts for NM27C010QE200
This table gives cross-reference parts and alternative options found for NM27C010QE200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NM27C010QE200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
AT27CL010-20DI | UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 | Atmel Corporation | NM27C010QE200 vs AT27CL010-20DI |
AM27C010-200DIB | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 | Spansion | NM27C010QE200 vs AM27C010-200DIB |
TC571001D-20 | IC 128K X 8 UVPROM, 200 ns, CDIP32, CERDIP-32, Programmable ROM | Toshiba America Electronic Components | NM27C010QE200 vs TC571001D-20 |
HN27C301AG-20 | 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, CERDIP-32 | Renesas Electronics Corporation | NM27C010QE200 vs HN27C301AG-20 |
NMC27C010Q20 | 128KX8 UVPROM, 200ns, CDIP32, CERAMIC, DIP-32 | Texas Instruments | NM27C010QE200 vs NMC27C010Q20 |
AM27C010-200DE | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 | Spansion | NM27C010QE200 vs AM27C010-200DE |
DPV27C101-200M | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 | Twilight Technology Inc | NM27C010QE200 vs DPV27C101-200M |
AM27C010-200DEB | UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 | AMD | NM27C010QE200 vs AM27C010-200DEB |
AM27C010-200DCB | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 | Spansion | NM27C010QE200 vs AM27C010-200DCB |
DPV27C101-200I | UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 | B&B Electronics Manufacturing Company | NM27C010QE200 vs DPV27C101-200I |