Memory
NM27C010QE200
Description: UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32

Overview of NM27C010QE200 by Fairchild Semiconductor Corporation

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Computing and Data Storage Financial Technology (Fintech) Telecommunications

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Part Data Attributes for NM27C010QE200 by Fairchild Semiconductor Corporation

NM27C010QE200
Fairchild Semiconductor Corporation
-
-
Pbfree Code
No
Rohs Code
No
Part Life Cycle Code
Obsolete
Ihs Manufacturer
FAIRCHILD SEMICONDUCTOR CORP
Part Package Code
DIP
Package Description
WINDOWED, CERAMIC, DIP-32
Pin Count
32
Reach Compliance Code
compliant
ECCN Code
EAR99
HTS Code
8542.32.00.61
Access Time-Max
200 ns
I/O Type
COMMON
JESD-30 Code
R-GDIP-T32
JESD-609 Code
e0
Memory Density
1048576 bit
Memory IC Type
UVPROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
131072 words
Number of Words Code
128000
Operating Mode
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
128KX8
Output Characteristics
3-STATE
Package Body Material
CERAMIC, GLASS-SEALED
Package Code
WDIP
Package Equivalence Code
DIP32,.6
Package Shape
RECTANGULAR
Package Style
IN-LINE, WINDOW
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.969 mm
Standby Current-Max
0.0001 A
Supply Current-Max
0.03 mA
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Finish
TIN LEAD
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
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  1. NM27C010QE200
    Fairchild Semiconductor Corporation
    UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32
    VS

Alternate Parts for NM27C010QE200

This table gives cross-reference parts and alternative options found for NM27C010QE200. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of NM27C010QE200, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
AT27CL010-20DI UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation NM27C010QE200 vs AT27CL010-20DI
AM27C010-200DIB UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion NM27C010QE200 vs AM27C010-200DIB
TC571001D-20 IC 128K X 8 UVPROM, 200 ns, CDIP32, CERDIP-32, Programmable ROM Toshiba America Electronic Components NM27C010QE200 vs TC571001D-20
HN27C301AG-20 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, CERDIP-32 Renesas Electronics Corporation NM27C010QE200 vs HN27C301AG-20
NMC27C010Q20 128KX8 UVPROM, 200ns, CDIP32, CERAMIC, DIP-32 Texas Instruments NM27C010QE200 vs NMC27C010Q20
AM27C010-200DE UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion NM27C010QE200 vs AM27C010-200DE
DPV27C101-200M UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 Twilight Technology Inc NM27C010QE200 vs DPV27C101-200M
AM27C010-200DEB UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD NM27C010QE200 vs AM27C010-200DEB
AM27C010-200DCB UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion NM27C010QE200 vs AM27C010-200DCB
DPV27C101-200I UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 B&B Electronics Manufacturing Company NM27C010QE200 vs DPV27C101-200I
Part Number Description Manufacturer Compare
TMS27C010A-200JL 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, WINDOWED, CERAMIC, DIP-32 Texas Instruments NM27C010QE200 vs TMS27C010A-200JL
5962-8961403XX UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 Intel Corporation NM27C010QE200 vs 5962-8961403XX
AT27CL010-20DM UVPROM, 128KX8, 200ns, CMOS, CDIP32, 0.600 INCH, WINDOWED, CERDIP-32 Atmel Corporation NM27C010QE200 vs AT27CL010-20DM
AM27C010-200DI UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERAMIC, DIP-32 AMD NM27C010QE200 vs AM27C010-200DI
DPV27C101-200B UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 Twilight Technology Inc NM27C010QE200 vs DPV27C101-200B
HN27C101G-20 128KX8 UVPROM, 200ns, CDIP32, 0.600 INCH, CERDIP-32 Renesas Electronics Corporation NM27C010QE200 vs HN27C101G-20
AM27C010-200DCB UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion NM27C010QE200 vs AM27C010-200DCB
UPD27C1001AD-20 UVPROM, 128KX8, 200ns, CMOS, CDIP32, WINDOWED, CERDIP-32 NEC Electronics Group NM27C010QE200 vs UPD27C1001AD-20
DPV27C101-200M UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERDIP-32 Twilight Technology Inc NM27C010QE200 vs DPV27C101-200M
AM27C010-200DE UVPROM, 128KX8, 200ns, CMOS, CDIP32, CERAMIC, DIP-32 Spansion NM27C010QE200 vs AM27C010-200DE

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