Part Details for MX23L3212XI-12G by Macronix International Co Ltd
Overview of MX23L3212XI-12G by Macronix International Co Ltd
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Agriculture Technology
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Part Details for MX23L3212XI-12G
MX23L3212XI-12G CAD Models
MX23L3212XI-12G Part Data Attributes
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MX23L3212XI-12G
Macronix International Co Ltd
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Datasheet
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MX23L3212XI-12G
Macronix International Co Ltd
MASK ROM, 2MX16, 120ns, CMOS, PBGA48, 7 X 7 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, LEAD FREE, MO-219, BGA-48
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MACRONIX INTERNATIONAL CO LTD | |
| Part Package Code | BGA | |
| Package Description | LFBGA, BGA48,6X8,32 | |
| Pin Count | 48 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.71 | |
| Access Time-Max | 120 ns | |
| Alternate Memory Width | 8 | |
| JESD-30 Code | S-PBGA-B48 | |
| JESD-609 Code | e1 | |
| Length | 7 mm | |
| Memory Density | 33554432 bit | |
| Memory IC Type | MASK ROM | |
| Memory Width | 16 | |
| Number of Functions | 1 | |
| Number of Terminals | 48 | |
| Number of Words | 2097152 words | |
| Number of Words Code | 2000000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Organization | 2MX16 | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA48,6X8,32 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Parallel/Serial | PARALLEL | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.3 mm | |
| Standby Current-Max | 0.000005 A | |
| Supply Current-Max | 0.016 mA | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Supply Voltage-Min (Vsup) | 2.7 V | |
| Supply Voltage-Nom (Vsup) | 3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 7 mm |
Alternate Parts for MX23L3212XI-12G
This table gives cross-reference parts and alternative options found for MX23L3212XI-12G. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MX23L3212XI-12G, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| AM27C64-150DCB | UVPROM, 8KX8, 150ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | Rochester Electronics LLC | MX23L3212XI-12G vs AM27C64-150DCB |
| AM28F010-120JEB | Flash, 128KX8, 120ns, PQCC32, PLASTIC, LCC-32 | Rochester Electronics LLC | MX23L3212XI-12G vs AM28F010-120JEB |
| CY7C265-40DC | OTP ROM, 8KX8, 20ns, CMOS, CDIP28, 0.300 INCH, SLIM, CERDIP-28 | Cypress Semiconductor | MX23L3212XI-12G vs CY7C265-40DC |
| W27C020PM-12 | EEPROM, 256KX8, 120ns, Parallel, CMOS, PQCC32, PLASTIC, LCC-32 | Winbond Electronics Corp | MX23L3212XI-12G vs W27C020PM-12 |
| W27L01Q-90 | EEPROM, 128KX8, 90ns, Parallel, CMOS, PDSO32, 8 X 14 MM, STSOP-32 | Winbond Electronics Corp | MX23L3212XI-12G vs W27L01Q-90 |
| MX23C2000QC-70 | MASK ROM, 256KX8, 70ns, CMOS, PQCC32, PLASTIC, MO-052, LCC-32 | Macronix International Co Ltd | MX23L3212XI-12G vs MX23C2000QC-70 |
| HY27UF084G2-TPIS | Flash, 512MX8, PDSO48, 12 X 20 MM, 1.20 MM HEIGHT, LEAD FREE, PLASTIC, TSOP1-48 | SK Hynix Inc | MX23L3212XI-12G vs HY27UF084G2-TPIS |
| AM28F010-70FI | Flash, 128KX8, 70ns, PDSO32, REVERSE, TSOP-32 | Rochester Electronics LLC | MX23L3212XI-12G vs AM28F010-70FI |
| AM28F010-150JCT | Flash, 128KX8, 150ns, PQCC32, PLASTIC, LCC-32 | AMD | MX23L3212XI-12G vs AM28F010-150JCT |
| AM28F010-150PC | Flash, 128KX8, 150ns, PDIP32, PLASTIC, DIP-32 | Rochester Electronics LLC | MX23L3212XI-12G vs AM28F010-150PC |