Part Details for MT8889CC-1 by Microsemi Corporation
Overview of MT8889CC-1 by Microsemi Corporation
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Part Details for MT8889CC-1
MT8889CC-1 CAD Models
MT8889CC-1 Part Data Attributes
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MT8889CC-1
Microsemi Corporation
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MT8889CC-1
Microsemi Corporation
DTMF Signaling Circuit, CMOS, CDIP20,
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Part Package Code | DIP | |
| Package Description | CERDIP-20 | |
| Pin Count | 20 | |
| Reach Compliance Code | unknown | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-GDIP-T20 | |
| JESD-609 Code | e0 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | CERAMIC, GLASS-SEALED | |
| Package Code | DIP | |
| Package Equivalence Code | DIP20,.3 | |
| Package Shape | RECTANGULAR | |
| Package Style | IN-LINE | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 5.08 mm | |
| Supply Current-Max | 10 mA | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | NO | |
| Technology | CMOS | |
| Telecom IC Type | DTMF SIGNALING CIRCUIT | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | THROUGH-HOLE | |
| Terminal Pitch | 2.54 mm | |
| Terminal Position | DUAL | |
| Width | 7.62 mm |