Part Details for MR2147H by Intel Corporation
Overview of MR2147H by Intel Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for MR2147H
MR2147H CAD Models
MR2147H Part Data Attributes:
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MR2147H
Intel Corporation
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Datasheet
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MR2147H
Intel Corporation
Standard SRAM, 4KX1, 70ns, MOS, CQCC18
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| Rohs Code | No | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | INTEL CORP | |
| Package Description | QCCN, LCC18,.3X.43 | |
| Reach Compliance Code | unknown | |
| ECCN Code | 3A001.A.2.C | |
| HTS Code | 8542.32.00.41 | |
| Access Time-Max | 70 ns | |
| I/O Type | SEPARATE | |
| JESD-30 Code | R-XQCC-N18 | |
| JESD-609 Code | e0 | |
| Memory Density | 4096 bit | |
| Memory IC Type | STANDARD SRAM | |
| Memory Width | 1 | |
| Number of Terminals | 18 | |
| Number of Words | 4096 words | |
| Number of Words Code | 4000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Organization | 4KX1 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC | |
| Package Code | QCCN | |
| Package Equivalence Code | LCC18,.3X.43 | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Standby Voltage-Min | 4.5 V | |
| Supply Current-Max | 0.18 mA | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | MOS | |
| Temperature Grade | MILITARY | |
| Terminal Finish | Tin/Lead (Sn/Pb) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD |
Alternate Parts for MR2147H
This table gives cross-reference parts and alternative options found for MR2147H. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MR2147H, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM10480A-8CV | 16KX1 STANDARD SRAM, 8ns, CQCC20, FRIT SEALED, CERAMIC, LCC-20 | FUJITSU Limited | MR2147H vs MBM10480A-8CV |
| TD2114AL-4 | Standard SRAM, 1KX4, 200ns, NMOS, CDIP18, HERMETIC SEALED, CERAMIC, DIP-18 | Intel Corporation | MR2147H vs TD2114AL-4 |
| 6167LA15D | Standard SRAM, 16KX1, 15ns, CMOS, CDIP20, 0.300 INCH, CERAMIC, DIP-20 | Integrated Device Technology Inc | MR2147H vs 6167LA15D |
| SY10480-8DCS | Standard SRAM, 16KX1, 8ns, ECL, CDIP20, | Synergy Semiconductor Corp | MR2147H vs SY10480-8DCS |
| HM6167LP-6 | Standard SRAM, 16KX1, 85ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | Hitachi Ltd | MR2147H vs HM6167LP-6 |
| IDT6167SA15F | Standard SRAM, 16KX1, 15ns, CMOS, CDFP20, FP-20 | Integrated Device Technology Inc | MR2147H vs IDT6167SA15F |
| NMC2147HJ-2 | 4KX1 STANDARD SRAM, 45ns, CDIP18, CERAMIC, DIP-18 | Texas Instruments | MR2147H vs NMC2147HJ-2 |
| AM21L41-12DCB | Standard SRAM, 4KX1, 120ns, NMOS, CDIP18, CERAMIC, DIP-18 | AMD | MR2147H vs AM21L41-12DCB |
| HM4-65767BH-6:RD | Standard SRAM, 16KX1, 25ns, CMOS, CQCC20 | Matra MHS | MR2147H vs HM4-65767BH-6:RD |
| IDT6167SA20PG | Standard SRAM, 16KX1, 20ns, CMOS, PDIP20, 0.300 INCH, PLASTIC, DIP-20 | Integrated Device Technology Inc | MR2147H vs IDT6167SA20PG |