There are no models available for this part yet.
Overview of MPC850SEZT50 by Motorola Semiconductor Products
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
Where used in Applications:
Industrial Automation
Renewable Energy
Robotics and Drones
CAD Models for MPC850SEZT50 by Motorola Semiconductor Products
Part Data Attributes for MPC850SEZT50 by Motorola Semiconductor Products
|
|
|
|---|---|
|
Part Life Cycle Code
|
Obsolete
|
|
Ihs Manufacturer
|
MOTOROLA INC
|
|
Package Description
|
BGA,
|
|
Reach Compliance Code
|
unknown
|
|
HTS Code
|
8542.31.00.01
|
|
JESD-30 Code
|
R-PBGA-B256
|
|
Number of Terminals
|
256
|
|
Operating Temperature-Max
|
70 °C
|
|
Operating Temperature-Min
|
|
|
Package Body Material
|
PLASTIC/EPOXY
|
|
Package Code
|
BGA
|
|
Package Shape
|
RECTANGULAR
|
|
Package Style
|
GRID ARRAY
|
|
Qualification Status
|
Not Qualified
|
|
Supply Voltage-Nom
|
3.3 V
|
|
Surface Mount
|
YES
|
|
Technology
|
CMOS
|
|
Temperature Grade
|
COMMERCIAL
|
|
Terminal Form
|
BALL
|
|
Terminal Position
|
BOTTOM
|
|
uPs/uCs/Peripheral ICs Type
|
MICROPROCESSOR, RISC
|
Alternate Parts for MPC850SEZT50
This table gives cross-reference parts and alternative options found for MPC850SEZT50. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC850SEZT50, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| PPC604B133 | RISC Microprocessor, 32-Bit, 133MHz, CMOS, CBGA256, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-256 | Motorola Semiconductor Products | MPC850SEZT50 vs PPC604B133 |
| MPC604ARS25 | RISC Microprocessor, 32-Bit, 25MHz, CMOS, CBGA256, 21 MM, 1.27 MM PITCH, CERAMIC, BGA-256 | Motorola Semiconductor Products | MPC850SEZT50 vs MPC604ARS25 |
| MC9328MX1CVM15 | 32-BIT, 150MHz, RISC PROCESSOR, PBGA256, 14 X 14 MM, 1.30 MM HEIGHT, 0.80 MM PITCH, ROHS COMPLIANT, MAPBGA-256 | Freescale Semiconductor | MPC850SEZT50 vs MC9328MX1CVM15 |
| MPC870CZT66 | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256 | NXP Semiconductors | MPC850SEZT50 vs MPC870CZT66 |
| KMPC875VR66 | 32-BIT, 66 MHz, RISC PROCESSOR, PBGA256, LEAD FREE, PLASTIC, BGA-256 | Freescale Semiconductor | MPC850SEZT50 vs KMPC875VR66 |
| IBM25PPC750CXRKQ0124T | RISC Microprocessor, 32-Bit, 333MHz, CMOS, PBGA256, 27 X 27 MM, LEAD FREE, PLASTIC, BGA-256 | IBM | MPC850SEZT50 vs IBM25PPC750CXRKQ0124T |
| 79RC32H434-300BC | CABGA-256, Tray | Integrated Device Technology Inc | MPC850SEZT50 vs 79RC32H434-300BC |
| IBM25PPC750CXEJP5013T | RISC Microprocessor, 32-Bit, 500MHz, CMOS, PBGA256, 27 X 27 MM, PLASTIC, BGA-256 | IBM | MPC850SEZT50 vs IBM25PPC750CXEJP5013T |
| XPC850DECZT66B | 32-BIT, 66MHz, RISC PROCESSOR, PBGA256, PLASTIC, BGA-256 | Motorola Mobility LLC | MPC850SEZT50 vs XPC850DECZT66B |
| MPC604ARX133 | RISC Microprocessor, 32-Bit, 133MHz, CMOS, PBGA256, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-256 | Motorola Semiconductor Products | MPC850SEZT50 vs MPC604ARX133 |