MPC850SEZT50
vs
MPC604ARS25
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MOTOROLA INC
|
MOTOROLA INC
|
| Package Description |
BGA,
|
BGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| JESD-30 Code |
R-PBGA-B256
|
S-CBGA-B256
|
| Number of Terminals |
256
|
256
|
| Operating Temperature-Max |
70 °C
|
105 °C
|
| Operating Temperature-Min |
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
BGA
|
BGA
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
OTHER
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR, RISC
|
| Base Number Matches |
1
|
1
|
| Additional Feature |
|
TWO 128 ENTRY TLB; TEMP SPECIFIED AS JUNCTION TEMP
|
| Address Bus Width |
|
32
|
| Bit Size |
|
32
|
| Boundary Scan |
|
YES
|
| Clock Frequency-Max |
|
25 MHz
|
| External Data Bus Width |
|
64
|
| Format |
|
FLOATING POINT
|
| Integrated Cache |
|
NO
|
| Length |
|
21 mm
|
| Low Power Mode |
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
|
3
|
| Number of Serial I/Os |
|
|
| On Chip Data RAM Width |
|
|
| RAM (words) |
|
0
|
| Seated Height-Max |
|
3.16 mm
|
| Speed |
|
25 MHz
|
| Supply Voltage-Max |
|
3.465 V
|
| Supply Voltage-Min |
|
3.135 V
|
| Terminal Pitch |
|
1.27 mm
|
| Width |
|
21 mm
|
|
|
|
Compare MPC850SEZT50 with alternatives
Compare MPC604ARS25 with alternatives