Part Details for MPC603RRX200LC by Motorola Mobility LLC
Overview of MPC603RRX200LC by Motorola Mobility LLC
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Part Details for MPC603RRX200LC
MPC603RRX200LC CAD Models
MPC603RRX200LC Part Data Attributes:
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MPC603RRX200LC
Motorola Mobility LLC
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Datasheet
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MPC603RRX200LC
Motorola Mobility LLC
32-BIT, 200MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255
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Part Life Cycle Code | Transferred | |
Ihs Manufacturer | MOTOROLA INC | |
Part Package Code | BGA | |
Package Description | BGA, | |
Pin Count | 255 | |
Reach Compliance Code | unknown | |
HTS Code | 8542.31.00.01 | |
Address Bus Width | 32 | |
Bit Size | 32 | |
Boundary Scan | NO | |
External Data Bus Width | 64 | |
Format | FLOATING POINT | |
Integrated Cache | YES | |
JESD-30 Code | S-CBGA-B255 | |
Length | 21 mm | |
Low Power Mode | YES | |
Number of Terminals | 255 | |
Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
Package Code | BGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY | |
Qualification Status | Not Qualified | |
Seated Height-Max | 3 mm | |
Speed | 200 MHz | |
Supply Voltage-Nom | 2.5 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Form | BALL | |
Terminal Pitch | 1.27 mm | |
Terminal Position | BOTTOM | |
Width | 21 mm | |
uPs/uCs/Peripheral ICs Type | MICROPROCESSOR, RISC |
Alternate Parts for MPC603RRX200LC
This table gives cross-reference parts and alternative options found for MPC603RRX200LC. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC603RRX200LC, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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TS(X)PC603PVGU/T6LE | 32-BIT, 166 MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 | e2v technologies | MPC603RRX200LC vs TS(X)PC603PVGU/T6LE |
TS(X)PC603RVGU/T6L(C) | RISC Microprocessor, 32-Bit, 166MHz, CMOS, CBGA255 | Thales Group | MPC603RRX200LC vs TS(X)PC603RVGU/T6L(C) |
WEDMC64603RV200CM | RISC Microprocessor, 32-Bit, 200MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, CGA-255 | Microsemi Corporation | MPC603RRX200LC vs WEDMC64603RV200CM |
MPC603RRX266LC | 32-BIT, 266 MHz, RISC PROCESSOR, CBGA255, CERAMIC, BGA-255 | Freescale Semiconductor | MPC603RRX200LC vs MPC603RRX266LC |
TSPC740AMGSB/T12LE | RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 | Atmel Corporation | MPC603RRX200LC vs TSPC740AMGSB/T12LE |
PCX740PVGU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 3 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | MPC603RRX200LC vs PCX740PVGU300LE |
MPC745BPX350LX | 32-BIT, 350MHz, RISC PROCESSOR, PBGA255, 21 X 21 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, PLASTIC, BGA-255 | Motorola Mobility LLC | MPC603RRX200LC vs MPC745BPX350LX |
PCX740PMGSU300LE | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 | Atmel Corporation | MPC603RRX200LC vs PCX740PMGSU300LE |
PC740PMGSU333LE | RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, 21 X 21 MM, 4 MM HEIGHT, 1.27 MM PITCH, CERAMIC, CGA-255 | Atmel Corporation | MPC603RRX200LC vs PC740PMGSU333LE |
TSPC603EVG4LL | RISC Microprocessor, 32-Bit, 120MHz, CMOS, CBGA255, 21 MM, 3.16 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-255 | Atmel Corporation | MPC603RRX200LC vs TSPC603EVG4LL |