Memory
MN232002
Panasonic Electronic Components
Description: MASK ROM, 256KX8, 150ns, NMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32

Overview of MN232002 by Panasonic Electronic Components

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Environmental Monitoring Agriculture Technology Telecommunications

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Part Data Attributes for MN232002 by Panasonic Electronic Components

MN232002
Panasonic Electronic Components
-
-
Part Life Cycle Code
Obsolete
Ihs Manufacturer
PANASONIC CORP
Part Package Code
DIP
Package Description
DIP,
Pin Count
32
Reach Compliance Code
unknown
ECCN Code
EAR99
HTS Code
8542.32.00.71
Access Time-Max
200 ns
JESD-30 Code
R-PDIP-T32
Length
42.1 mm
Memory Density
8388608 bit
Memory IC Type
MASK ROM
Memory Width
8
Number of Functions
1
Number of Terminals
32
Number of Words
262144 words
Number of Words Code
256000
Operating Mode
ASYNCHRONOUS
Organization
1MX8
Package Body Material
PLASTIC/EPOXY
Package Code
DIP
Package Shape
RECTANGULAR
Package Style
IN-LINE
Parallel/Serial
PARALLEL
Qualification Status
Not Qualified
Seated Height-Max
5.08 mm
Supply Voltage-Nom (Vsup)
5 V
Surface Mount
NO
Technology
NMOS
Terminal Form
THROUGH-HOLE
Terminal Pitch
2.54 mm
Terminal Position
DUAL
Width
15.24 mm
Want to compare parts?
  1. MN232002
    Panasonic Electronic Components
    MASK ROM, 256KX8, 150ns, NMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32
    VS

Alternate Parts for MN232002

This table gives cross-reference parts and alternative options found for MN232002. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MN232002, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
LH532100BD MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp MN232002 vs LH532100BD
KM23C2001-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor MN232002 vs KM23C2001-15
MS312001-15PC MASK ROM, 256KX8, 150ns, CMOS, PDIP32, P32-1 Mosel Vitelic Corporation MN232002 vs MS312001-15PC
GM23C2000-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, Goldstar Electron Co Ltd MN232002 vs GM23C2000-15
AM27X020-155PI MASK ROM, 256KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD MN232002 vs AM27X020-155PI
KM23C2000-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor MN232002 vs KM23C2000-15
HM23C2002P-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hualon Microelectronics Corp MN232002 vs HM23C2002P-15
Part Number Description Manufacturer Compare
LH532100BD MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Sharp Corp MN232002 vs LH532100BD
HM23C2002P-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Hualon Microelectronics Corp MN232002 vs HM23C2002P-15
AM27X020-155PI MASK ROM, 256KX8, 150ns, CMOS, PDIP32, PLASTIC, DIP-32 AMD MN232002 vs AM27X020-155PI
KM23C2001-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Samsung Semiconductor MN232002 vs KM23C2001-15
GM23C2000-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, Goldstar Electron Co Ltd MN232002 vs GM23C2000-15
MX23C2000PC-15 MASK ROM, 256KX8, 150ns, CMOS, PDIP32, 0.600 INCH, PLASTIC, DIP-32 Macronix International Co Ltd MN232002 vs MX23C2000PC-15
MS312001-15PC MASK ROM, 256KX8, 150ns, CMOS, PDIP32, P32-1 Mosel Vitelic Corporation MN232002 vs MS312001-15PC

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