Datasheets
MN231001 by: Panasonic Electronic Components

MASK ROM, 128KX8, 150ns, NMOS, PDIP28, DIP-28

Part Details for MN231001 by Panasonic Electronic Components

Overview of MN231001 by Panasonic Electronic Components

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Applications Consumer Electronics Internet of Things (IoT) Smart Cities Transportation and Logistics Automotive

Part Details for MN231001

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MN231001 Part Data Attributes:

MN231001 Panasonic Electronic Components
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MN231001 Panasonic Electronic Components MASK ROM, 128KX8, 150ns, NMOS, PDIP28, DIP-28
Part Life Cycle Code Obsolete
Ihs Manufacturer PANASONIC CORP
Part Package Code DIP
Package Description DIP,
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.71
Access Time-Max 200 ns
JESD-30 Code R-PDIP-T28
Memory Density 8388608 bit
Memory IC Type MASK ROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 131072 words
Number of Words Code 128000
Operating Mode ASYNCHRONOUS
Organization 1MX8
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Shape RECTANGULAR
Package Style IN-LINE
Parallel/Serial PARALLEL
Qualification Status Not Qualified
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology NMOS
Terminal Form THROUGH-HOLE
Terminal Position DUAL

Alternate Parts for MN231001

This table gives cross-reference parts and alternative options found for MN231001. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MN231001, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
KM23C1001-15 MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Samsung Semiconductor MN231001 vs KM23C1001-15
HN62321P 128KX8 MASK PROM, 150ns, PDIP28, PLASTIC, DIP-28 Renesas Electronics Corporation MN231001 vs HN62321P
S631001M-P MASK ROM, 128KX8, 150ns, CMOS, PDIP28 Gould Ami MN231001 vs S631001M-P
S631000-15P MASK ROM, 128KX8, 150ns, CMOS, PDIP28 Gould Ami MN231001 vs S631000-15P
S631000I-P MASK ROM, 128KX8, 150ns, CMOS, PDIP28 Gould Ami MN231001 vs S631000I-P
S631001I-C MASK ROM, 128KX8, 150ns, CMOS, CDIP28 Gould Ami MN231001 vs S631001I-C
S631000C-C MASK ROM, 128KX8, 150ns, CMOS, CDIP28 Gould Ami MN231001 vs S631000C-C
HM23C1024-15 MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Hualon Microelectronics Corp MN231001 vs HM23C1024-15
HM23C1000AP-15 MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Hualon Microelectronics Corp MN231001 vs HM23C1000AP-15
KM23C1000-15 MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Samsung Semiconductor MN231001 vs KM23C1000-15
Part Number Description Manufacturer Compare
KM23C1001-15 MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Samsung Semiconductor MN231001 vs KM23C1001-15
S631000-15P MASK ROM, 128KX8, 150ns, CMOS, PDIP28 Gould Ami MN231001 vs S631000-15P
HM23C1000AP-15 MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Hualon Microelectronics Corp MN231001 vs HM23C1000AP-15
S631000C-C MASK ROM, 128KX8, 150ns, CMOS, CDIP28 Gould Ami MN231001 vs S631000C-C
S631001C-P MASK ROM, 128KX8, 150ns, CMOS, PDIP28 Gould Ami MN231001 vs S631001C-P
S631001M-P MASK ROM, 128KX8, 150ns, CMOS, PDIP28 Gould Ami MN231001 vs S631001M-P
HM23C1024A-15 MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Hualon Microelectronics Corp MN231001 vs HM23C1024A-15
KM23C1000-15 MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Samsung Semiconductor MN231001 vs KM23C1000-15
HM23C1024-15 MASK ROM, 128KX8, 150ns, CMOS, PDIP28, 0.600 INCH, PLASTIC, DIP-28 Hualon Microelectronics Corp MN231001 vs HM23C1024-15
S631000I-P MASK ROM, 128KX8, 150ns, CMOS, PDIP28 Gould Ami MN231001 vs S631000I-P

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