There are no models available for this part yet.
Overview of MH56D72KTN-10 by Mitsubishi Electric
Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
- Distributor Offerings: ( 0 listings )
- Number of FFF Equivalents: ( 0 replacements )
- CAD Models: ( Request Part )
- Number of Functional Equivalents: ( 10 options )
- Part Data Attributes ( Available )
- Reference Designs: ( Not Available )
CAD Models for MH56D72KTN-10 by Mitsubishi Electric
Part Data Attributes for MH56D72KTN-10 by Mitsubishi Electric
|
|
---|---|
Part Life Cycle Code
|
Obsolete
|
Ihs Manufacturer
|
MITSUBISHI ELECTRIC CORP
|
Part Package Code
|
DIMM
|
Package Description
|
DIMM, DIMM184
|
Pin Count
|
184
|
Reach Compliance Code
|
unknown
|
ECCN Code
|
EAR99
|
HTS Code
|
8542.32.00.36
|
Access Mode
|
DUAL BANK PAGE BURST
|
Access Time-Max
|
0.8 ns
|
Additional Feature
|
AUTO/SELF REFRESH
|
Clock Frequency-Max (fCLK)
|
125 MHz
|
I/O Type
|
COMMON
|
JESD-30 Code
|
R-XDMA-N184
|
Memory Density
|
19327352832 bit
|
Memory IC Type
|
DDR DRAM MODULE
|
Memory Width
|
72
|
Number of Functions
|
1
|
Number of Ports
|
1
|
Number of Terminals
|
184
|
Number of Words
|
268435456 words
|
Number of Words Code
|
256000000
|
Operating Mode
|
SYNCHRONOUS
|
Operating Temperature-Max
|
70 °C
|
Operating Temperature-Min
|
|
Organization
|
256MX72
|
Output Characteristics
|
3-STATE
|
Package Body Material
|
UNSPECIFIED
|
Package Code
|
DIMM
|
Package Equivalence Code
|
DIMM184
|
Package Shape
|
RECTANGULAR
|
Package Style
|
MICROELECTRONIC ASSEMBLY
|
Qualification Status
|
Not Qualified
|
Refresh Cycles
|
8192
|
Self Refresh
|
YES
|
Standby Current-Max
|
1.234 A
|
Supply Current-Max
|
7.714 mA
|
Supply Voltage-Max (Vsup)
|
2.7 V
|
Supply Voltage-Min (Vsup)
|
2.3 V
|
Supply Voltage-Nom (Vsup)
|
2.5 V
|
Surface Mount
|
NO
|
Technology
|
CMOS
|
Temperature Grade
|
COMMERCIAL
|
Terminal Form
|
NO LEAD
|
Terminal Pitch
|
1.27 mm
|
Terminal Position
|
DUAL
|
Alternate Parts for MH56D72KTN-10
This table gives cross-reference parts and alternative options found for MH56D72KTN-10. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MH56D72KTN-10, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
---|---|---|---|
NT2GD72S4NC0FV-5T | DDR DRAM Module, 256MX72, 0.7ns, CMOS, ROHS COMPLIANT, DIMM-184 | Nanya Technology Corporation | MH56D72KTN-10 vs NT2GD72S4NC0FV-5T |
M312L5628MT0-CA0 | DDR DRAM Module, 256MX72, 0.8ns, CMOS, DIMM-184 | Samsung Semiconductor | MH56D72KTN-10 vs M312L5628MT0-CA0 |
W3EG2128M72AFSR403AD3M | DDR DRAM Module, 256MX72, 0.7ns, CMOS, DIMM-184 | Microsemi Corporation | MH56D72KTN-10 vs W3EG2128M72AFSR403AD3M |
W3EG72255S202AJD3M | DDR DRAM Module, 256MX72, 0.8ns, CMOS, DIMM-184 | Microsemi Corporation | MH56D72KTN-10 vs W3EG72255S202AJD3M |
M312L5620AUS-CB3 | DDR DRAM Module, 256MX72, 0.7ns, CMOS, ROHS COMPLIANT, DIMM-184 | Samsung Semiconductor | MH56D72KTN-10 vs M312L5620AUS-CB3 |
M312L5623AUS-CB3 | DDR DRAM Module, 256MX72, 0.7ns, CMOS, ROHS COMPLIANT, DIMM-184 | Samsung Semiconductor | MH56D72KTN-10 vs M312L5623AUS-CB3 |
W3EG72256S263JD3M | DDR DRAM Module, 256MX72, 0.75ns, CMOS, DIMM-184 | Microsemi Corporation | MH56D72KTN-10 vs W3EG72256S263JD3M |
M312L5628BT0-CA0 | DDR DRAM Module, 256MX72, 0.8ns, CMOS, DIMM-184 | Samsung Semiconductor | MH56D72KTN-10 vs M312L5628BT0-CA0 |
W3EG72256S263AJD3SG | DDR DRAM Module, 256MX72, 0.75ns, CMOS, ROHS COMPLIANT, DIMM-184 | Microsemi Corporation | MH56D72KTN-10 vs W3EG72256S263AJD3SG |
MT18VDDT25672LAIG-335XX | DDR DRAM Module, 256MX72, 0.7ns, CMOS, DIMM-184 | Micron Technology Inc | MH56D72KTN-10 vs MT18VDDT25672LAIG-335XX |