Part Details for MCF52221CVM80 by NXP Semiconductors
Overview of MCF52221CVM80 by NXP Semiconductors
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Industrial Automation
Renewable Energy
Robotics and Drones
Price & Stock for MCF52221CVM80
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
30M1348
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Newark | 32-Bit Microcontroller Ic, Product Range:-, Device Core:Coldfire V2, Data Bus Width:32 Bit, Operating Frequency Max:80Mhz, Program Memory Size:128Kb, No. Of Pins:81Pins, Ic Case/Package:Mapbga, No. Of I/O S:56I/O S, Qualification:-Rohs Compliant: Yes |Nxp MCF52221CVM80 Min Qty: 1200 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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$10.8800 | Buy Now |
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DISTI #
4375743
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Farnell | MICROCONTROLLERS IC'S RoHS: Compliant Min Qty: 240 Lead time: 3 Weeks, 1 Days Container: Each | 480 |
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$18.9552 | Buy Now |
Part Details for MCF52221CVM80
MCF52221CVM80 CAD Models
MCF52221CVM80 Part Data Attributes:
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MCF52221CVM80
NXP Semiconductors
Buy Now
Datasheet
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Compare Parts:
MCF52221CVM80
NXP Semiconductors
32-BIT, FLASH, 66MHz, RISC MICROCONTROLLER, PBGA81
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 10 X 10 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-81 | |
| Reach Compliance Code | compliant | |
| ECCN Code | 3A991.A.2 | |
| HTS Code | 8542.31.00.01 | |
| Factory Lead Time | 4 Weeks | |
| Has ADC | YES | |
| Address Bus Width | ||
| Bit Size | 32 | |
| CPU Family | COLDFIRE | |
| Clock Frequency-Max | 80 MHz | |
| DAC Channels | NO | |
| DMA Channels | YES | |
| External Data Bus Width | ||
| JESD-30 Code | S-PBGA-B81 | |
| JESD-609 Code | e1 | |
| Length | 10 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of I/O Lines | 56 | |
| Number of Terminals | 81 | |
| On Chip Program ROM Width | 8 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| PWM Channels | YES | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Equivalence Code | BGA81,9X9,40 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| RAM (bytes) | 16384 | |
| ROM (words) | 131072 | |
| ROM Programmability | FLASH | |
| Seated Height-Max | 1.6 mm | |
| Speed | 66 MHz | |
| Supply Voltage-Max | 3.6 V | |
| Supply Voltage-Min | 3.3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 1 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 10 mm | |
| uPs/uCs/Peripheral ICs Type | MICROCONTROLLER, RISC |