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MC9S12XF512MLH by:

16-bit MCU, S12X core, 512KB Flash, 50MHz, -40/+125degC, QFP 64

Part Details for MC9S12XF512MLH by Freescale Semiconductor

Overview of MC9S12XF512MLH by Freescale Semiconductor

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Automotive Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for MC9S12XF512MLH

MC9S12XF512MLH CAD Models

MC9S12XF512MLH Part Data Attributes:

MC9S12XF512MLH Freescale Semiconductor
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MC9S12XF512MLH Freescale Semiconductor 16-bit MCU, S12X core, 512KB Flash, 50MHz, -40/+125degC, QFP 64
Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer FREESCALE SEMICONDUCTOR INC
Part Package Code QFP
Pin Count 64
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.31.00.01
Samacsys Manufacturer NXP
Bit Size 16
CPU Family CPU12
JESD-30 Code S-PQFP-G64
JESD-609 Code e3
Moisture Sensitivity Level 3
Number of Terminals 64
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code QFP
Package Equivalence Code QFP64,.47SQ,20
Package Shape SQUARE
Package Style FLATPACK
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
RAM (bytes) 32768
ROM (words) 524288
ROM Programmability FLASH
Speed 40 MHz
Supply Current-Max 110 mA
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Finish MATTE TIN
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Terminal Position QUAD
Time@Peak Reflow Temperature-Max (s) 40
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC

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