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Part Details for MC33879APEK by NXP Semiconductors
Overview of MC33879APEK by NXP Semiconductors
- Distributor Offerings: (3 listings)
- Number of FFF Equivalents: (0 crosses)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 crosses)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Price & Stock for MC33879APEK
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
69W9828
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Newark | Load Switch, Octal, 16Bit Spi, 32Wsoic, Power Load Switch Type:High Side, Low Side, Input Voltage:27.5V, Current Limit:1.2A, On State Resistance:0.75Ohm, Distribution Switch Case Style:Wsoic, No. Of Pins:32Pins, Thermal Rohs Compliant: Yes |Nxp MC33879APEK Min Qty: 1 Package Multiple: 1 Date Code: 0 Container: Bulk | 0 |
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Buy Now | |
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Sense Electronic Company Limited | SSOP32 | 1999 |
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RFQ | |
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Win Source Electronics | Configurable Octal Serial Switch with Open Load Detect Current Disable | IC SW SERIAL OCTAL 32SOIC | 99000 |
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$1.5080 / $2.2610 | Buy Now |
Part Details for MC33879APEK
MC33879APEK CAD Models
MC33879APEK Part Data Attributes:
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MC33879APEK
NXP Semiconductors
Buy Now
Datasheet
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MC33879APEK
NXP Semiconductors
1.2A BUF OR INV BASED PRPHL DRVR, PDSO32
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| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | NXP SEMICONDUCTORS | |
| Package Description | 0.65 PITCH, LEAD FREE, SOIC-32 | |
| Reach Compliance Code | compliant | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.39.00.01 | |
| Samacsys Manufacturer | NXP | |
| Built-in Protections | TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE | |
| Input Characteristics | STANDARD | |
| Interface IC Type | BUFFER OR INVERTER BASED PERIPHERAL DRIVER | |
| JESD-30 Code | R-PDSO-G32 | |
| JESD-609 Code | e3 | |
| Length | 11 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Output Current Flow Direction | SINK | |
| Output Peak Current Limit-Nom | 1.2 A | |
| Output Polarity | TRUE | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HSSOP | |
| Package Equivalence Code | SOP32,.4,25 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 2.65 mm | |
| Supply Current-Max | 0.7 mA | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 3.1 V | |
| Supply Voltage-Nom | 5 V | |
| Surface Mount | YES | |
| Technology | BCDMOS | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | Tin (Sn) | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.65 mm | |
| Terminal Position | DUAL | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Turn-off Time | 100 µs | |
| Turn-on Time | 50 µs | |
| Width | 7.5 mm |