Part Details for MC2062DIE by Mindspeed Technologies Inc
Overview of MC2062DIE by Mindspeed Technologies Inc
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Applications
Energy and Power Systems
Transportation and Logistics
Renewable Energy
Automotive
Part Details for MC2062DIE
MC2062DIE CAD Models
MC2062DIE Part Data Attributes:
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MC2062DIE
Mindspeed Technologies Inc
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MC2062DIE
Mindspeed Technologies Inc
Interface Circuit, BICMOS, WAFER-24
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MINDSPEED TECHNOLOGIES INC | |
| Part Package Code | WAFER | |
| Package Description | DIE, | |
| Pin Count | 24 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Interface IC Type | INTERFACE CIRCUIT | |
| JESD-30 Code | R-XUUC-N24 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | DIE | |
| Package Shape | RECTANGULAR | |
| Package Style | UNCASED CHIP | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 3 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Form | NO LEAD | |
| Terminal Position | UPPER |