Datasheets
MC10XS3435BHFKR2 by:

4 CHANNEL, BUF OR INV BASED PRPHL DRVR, BCC24

Part Details for MC10XS3435BHFKR2 by NXP Semiconductors

Overview of MC10XS3435BHFKR2 by NXP Semiconductors

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Applications Internet of Things (IoT) Environmental Monitoring Financial Technology (Fintech) Smart Cities Transportation and Logistics Agriculture Technology Telecommunications Virtual Reality (VR), Augmented Reality (AR), and Vision Systems Education and Research Consumer Electronics Security and Surveillance Audio and Video Systems Computing and Data Storage Healthcare Entertainment and Gaming

Part Details for MC10XS3435BHFKR2

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MC10XS3435BHFKR2 Part Data Attributes:

MC10XS3435BHFKR2 NXP Semiconductors
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MC10XS3435BHFKR2 NXP Semiconductors 4 CHANNEL, BUF OR INV BASED PRPHL DRVR, BCC24
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS
Package Description 12 X 12 MM, 2.10 MM HEIGHT, 0.90 MM PITCH, ROHS COMPLIANT, PQFN-24
Reach Compliance Code not_compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
Samacsys Manufacturer NXP
Additional Feature ALSO OPERATES WITH 4 TO 28 VOLTS
Built-in Protections TRANSIENT; OVER CURRENT; OVER VOLTAGE; THERMAL; UNDER VOLTAGE
Driver Number of Bits 4
Interface IC Type BUFFER OR INVERTER BASED PERIPHERAL DRIVER
JESD-30 Code S-XBCC-B24
Length 12 mm
Moisture Sensitivity Level 3
Number of Functions 4
Number of Terminals 24
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Current Flow Direction SINK
Package Body Material UNSPECIFIED
Package Code HBCC
Package Equivalence Code LCC24(UNSPEC)
Package Shape SQUARE
Package Style CHIP CARRIER, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified
Seated Height-Max 2.2 mm
Supply Voltage-Max 20 V
Supply Voltage-Min 6 V
Supply Voltage-Nom 12 V
Surface Mount YES
Technology CMOS
Temperature Grade AUTOMOTIVE
Terminal Form BUTT
Terminal Position BOTTOM
Time@Peak Reflow Temperature-Max (s) 40
Turn-off Time 95 µs
Turn-on Time 95 µs
Width 12 mm

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