Part Details for MBM2764-30 by FUJITSU Limited
Overview of MBM2764-30 by FUJITSU Limited
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 crosses)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Industrial Automation
Part Details for MBM2764-30
MBM2764-30 CAD Models
MBM2764-30 Part Data Attributes:
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MBM2764-30
FUJITSU Limited
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Datasheet
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MBM2764-30
FUJITSU Limited
8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32
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| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | FUJITSU SEMICONDUCTOR AMERICA INC | |
| Part Package Code | QFJ | |
| Package Description | WQCCN, | |
| Pin Count | 32 | |
| Reach Compliance Code | unknown | |
| ECCN Code | EAR99 | |
| HTS Code | 8542.32.00.61 | |
| Access Time-Max | 300 ns | |
| JESD-30 Code | R-CQCC-N32 | |
| Length | 13.97 mm | |
| Memory Density | 65536 bit | |
| Memory IC Type | UVPROM | |
| Memory Width | 8 | |
| Number of Functions | 1 | |
| Number of Terminals | 32 | |
| Number of Words | 8192 words | |
| Number of Words Code | 8000 | |
| Operating Mode | ASYNCHRONOUS | |
| Operating Temperature-Max | 70 °C | |
| Operating Temperature-Min | ||
| Organization | 8KX8 | |
| Output Characteristics | 3-STATE | |
| Package Body Material | CERAMIC, METAL-SEALED COFIRED | |
| Package Code | WQCCN | |
| Package Shape | RECTANGULAR | |
| Package Style | CHIP CARRIER, WINDOW | |
| Parallel/Serial | PARALLEL | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 3.3 mm | |
| Supply Current-Max | 0.1 mA | |
| Supply Voltage-Max (Vsup) | 5.5 V | |
| Supply Voltage-Min (Vsup) | 4.5 V | |
| Supply Voltage-Nom (Vsup) | 5 V | |
| Surface Mount | YES | |
| Technology | NMOS | |
| Temperature Grade | COMMERCIAL | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 1.27 mm | |
| Terminal Position | QUAD | |
| Width | 11.43 mm |
Alternate Parts for MBM2764-30
This table gives cross-reference parts and alternative options found for MBM2764-30. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MBM2764-30, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| MBM2764-30 | UVPROM, 8KX8, 300ns, NMOS, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Semiconductor Limited | MBM2764-30 vs MBM2764-30 |
| AM27C64-300LC | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | MBM2764-30 vs AM27C64-300LC |
| AM2764A-30LI | UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | MBM2764-30 vs AM2764A-30LI |
| AM2764A-30LCB | UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | MBM2764-30 vs AM2764A-30LCB |
| AM27C64-300LIB | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | MBM2764-30 vs AM27C64-300LIB |
| AM27C64-300LI | UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 | AMD | MBM2764-30 vs AM27C64-300LI |
| MBM27C64-30-WZ | 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Limited | MBM2764-30 vs MBM27C64-30-WZ |
| AM2764A-30LC | UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | MBM2764-30 vs AM2764A-30LC |
| AM2764A-30LEB | UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 | AMD | MBM2764-30 vs AM2764A-30LEB |
| MBM2764-30-X | 8KX8 UVPROM, 300ns, CQCC32, METAL SEALED, CERAMIC, LCC-32 | FUJITSU Limited | MBM2764-30 vs MBM2764-30-X |