Datasheets
AM27C64-305DI by: AMD

UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28

Part Details for AM27C64-305DI by AMD

Overview of AM27C64-305DI by AMD

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Applications Industrial Automation

Part Details for AM27C64-305DI

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AM27C64-305DI Part Data Attributes

AM27C64-305DI AMD
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AM27C64-305DI AMD UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
Pbfree Code No
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer ADVANCED MICRO DEVICES INC
Part Package Code DIP
Package Description WDIP, DIP28,.6
Pin Count 28
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.32.00.61
Access Time-Max 300 ns
I/O Type COMMON
JESD-30 Code R-GDIP-T28
Length 37.1475 mm
Memory Density 65536 bit
Memory IC Type UVPROM
Memory Width 8
Number of Functions 1
Number of Terminals 28
Number of Words 8192 words
Number of Words Code 8000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Organization 8KX8
Output Characteristics 3-STATE
Package Body Material CERAMIC, GLASS-SEALED
Package Code WDIP
Package Equivalence Code DIP28,.6
Package Shape RECTANGULAR
Package Style IN-LINE, WINDOW
Parallel/Serial PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Programming Voltage 12.5 V
Qualification Status Not Qualified
Seated Height-Max 5.588 mm
Standby Current-Max 0.0001 A
Supply Current-Max 0.03 mA
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount NO
Technology CMOS
Temperature Grade INDUSTRIAL
Terminal Form THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 15.24 mm

Alternate Parts for AM27C64-305DI

This table gives cross-reference parts and alternative options found for AM27C64-305DI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C64-305DI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
MBM27C64-30Z-W IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC FUJITSU Semiconductor Limited AM27C64-305DI vs MBM27C64-30Z-W
TMS27C64-30JL 8KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 Texas Instruments AM27C64-305DI vs TMS27C64-30JL
27C64MQG/B30 UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 Thales Group AM27C64-305DI vs 27C64MQG/B30
AM27C64-300DI UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C64-305DI vs AM27C64-300DI
MBM27C64-30-XZ UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERDIP-28 FUJITSU Semiconductor Limited AM27C64-305DI vs MBM27C64-30-XZ
27C64MQG/B30 UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 Teledyne e2v AM27C64-305DI vs 27C64MQG/B30
MBM27C64-30Z EPROM, 8KX8, 300ns, CMOS, CDIP28, FUJITSU Limited AM27C64-305DI vs MBM27C64-30Z
M27C64A-30F1 8KX8 UVPROM, 300ns, CDIP28, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 STMicroelectronics AM27C64-305DI vs M27C64A-30F1
QD2764-3 UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Intel Corporation AM27C64-305DI vs QD2764-3
MBM2764-30Z UVPROM, 8KX8, 300ns, NMOS, CDIP28, CERDIP-28 FUJITSU Semiconductor Limited AM27C64-305DI vs MBM2764-30Z
Part Number Description Manufacturer Compare
AM27C64-305LI UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM27C64-305DI vs AM27C64-305LI
AM27C64-300DC UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C64-305DI vs AM27C64-300DC
DQ2764-30 UVPROM, 8KX8, 300ns, MOS, CDIP28 LSI Corporation AM27C64-305DI vs DQ2764-30
AM2764A-30LCB UVPROM, 8KX8, 300ns, NMOS, CQCC32, CERAMIC, LCC-32 AMD AM27C64-305DI vs AM2764A-30LCB
AM27C64-300DI UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 AMD AM27C64-305DI vs AM27C64-300DI
NMC27C64Q300 IC 8K X 8 UVPROM, 300 ns, CDIP28, WINDOWED, CERAMIC, DIP-28, Programmable ROM National Semiconductor Corporation AM27C64-305DI vs NMC27C64Q300
27LV64-30I/J 8K X 8 UVPROM, 300 ns, CDIP28, 0.600 INCH, CERDIP-28 Microchip Technology Inc AM27C64-305DI vs 27LV64-30I/J
AM27C64-300LI UVPROM, 8KX8, 300ns, CMOS, CQCC32, WINDOWED, CERAMIC, LCC-32 AMD AM27C64-305DI vs AM27C64-300LI
MBM27C64-30-XZ 8KX8 UVPROM, 300ns, CDIP28, CERDIP-28 FUJITSU Limited AM27C64-305DI vs MBM27C64-30-XZ
QD2764-3 UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 Intel Corporation AM27C64-305DI vs QD2764-3

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