Part Details for AM27C64-305DI by AMD
Overview of AM27C64-305DI by AMD
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (10 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (10 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Part Details for AM27C64-305DI
AM27C64-305DI CAD Models
AM27C64-305DI Part Data Attributes
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AM27C64-305DI
AMD
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Datasheet
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AM27C64-305DI
AMD
UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28
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Pbfree Code | No | |
Rohs Code | No | |
Part Life Cycle Code | Obsolete | |
Ihs Manufacturer | ADVANCED MICRO DEVICES INC | |
Part Package Code | DIP | |
Package Description | WDIP, DIP28,.6 | |
Pin Count | 28 | |
Reach Compliance Code | unknown | |
ECCN Code | EAR99 | |
HTS Code | 8542.32.00.61 | |
Access Time-Max | 300 ns | |
I/O Type | COMMON | |
JESD-30 Code | R-GDIP-T28 | |
Length | 37.1475 mm | |
Memory Density | 65536 bit | |
Memory IC Type | UVPROM | |
Memory Width | 8 | |
Number of Functions | 1 | |
Number of Terminals | 28 | |
Number of Words | 8192 words | |
Number of Words Code | 8000 | |
Operating Mode | ASYNCHRONOUS | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Organization | 8KX8 | |
Output Characteristics | 3-STATE | |
Package Body Material | CERAMIC, GLASS-SEALED | |
Package Code | WDIP | |
Package Equivalence Code | DIP28,.6 | |
Package Shape | RECTANGULAR | |
Package Style | IN-LINE, WINDOW | |
Parallel/Serial | PARALLEL | |
Peak Reflow Temperature (Cel) | NOT SPECIFIED | |
Programming Voltage | 12.5 V | |
Qualification Status | Not Qualified | |
Seated Height-Max | 5.588 mm | |
Standby Current-Max | 0.0001 A | |
Supply Current-Max | 0.03 mA | |
Supply Voltage-Max (Vsup) | 5.25 V | |
Supply Voltage-Min (Vsup) | 4.75 V | |
Supply Voltage-Nom (Vsup) | 5 V | |
Surface Mount | NO | |
Technology | CMOS | |
Temperature Grade | INDUSTRIAL | |
Terminal Form | THROUGH-HOLE | |
Terminal Pitch | 2.54 mm | |
Terminal Position | DUAL | |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED | |
Width | 15.24 mm |
Alternate Parts for AM27C64-305DI
This table gives cross-reference parts and alternative options found for AM27C64-305DI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of AM27C64-305DI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number | Description | Manufacturer | Compare |
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MBM27C64-30Z-W | IC,EPROM,8KX8,CMOS,DIP,28PIN,CERAMIC | FUJITSU Semiconductor Limited | AM27C64-305DI vs MBM27C64-30Z-W |
TMS27C64-30JL | 8KX8 UVPROM, 300ns, CDIP28, 0.600 INCH, WINDOWED, CERDIP-28 | Texas Instruments | AM27C64-305DI vs TMS27C64-30JL |
27C64MQG/B30 | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 | Thales Group | AM27C64-305DI vs 27C64MQG/B30 |
AM27C64-300DI | UVPROM, 8KX8, 300ns, CMOS, CDIP28, WINDOWED, CERAMIC, DIP-28 | AMD | AM27C64-305DI vs AM27C64-300DI |
MBM27C64-30-XZ | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | AM27C64-305DI vs MBM27C64-30-XZ |
27C64MQG/B30 | UVPROM, 8KX8, 300ns, CMOS, CDIP28, CERAMIC, DIP-28 | Teledyne e2v | AM27C64-305DI vs 27C64MQG/B30 |
MBM27C64-30Z | EPROM, 8KX8, 300ns, CMOS, CDIP28, | FUJITSU Limited | AM27C64-305DI vs MBM27C64-30Z |
M27C64A-30F1 | 8KX8 UVPROM, 300ns, CDIP28, LEAD FREE, CERAMIC, WINDOWED, FRIT SEALED, DIP-28 | STMicroelectronics | AM27C64-305DI vs M27C64A-30F1 |
QD2764-3 | UVPROM, 8KX8, 300ns, NMOS, CDIP28, HERMETIC SEALED, CERAMIC, DIP-28 | Intel Corporation | AM27C64-305DI vs QD2764-3 |
MBM2764-30Z | UVPROM, 8KX8, 300ns, NMOS, CDIP28, CERDIP-28 | FUJITSU Semiconductor Limited | AM27C64-305DI vs MBM2764-30Z |