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Part Details for MAX3738ETG+T by Analog Devices Inc
Results Overview of MAX3738ETG+T by Analog Devices Inc
- Distributor Offerings: (2 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (1 option)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Education and Research
Internet of Things (IoT)
Computing and Data Storage
Aerospace and Defense
Healthcare
Telecommunications
Automotive
MAX3738ETG+T Information
MAX3738ETG+T by Analog Devices Inc is an Other Interface IC.
Other Interface ICs are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for MAX3738ETG+T
| Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
700-MAX3738ETGT
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Mouser Electronics | Laser Drivers 155Mbps to 4.25Gbps SFF/SFP Laser Driver RoHS: Compliant | 455 |
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$2.3700 / $4.5200 | Buy Now |
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Analog Devices Inc | 155Mbps to 4.25Gbps SFF/SFP La Min Qty: 1 Package Multiple: 1 | 1377 |
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$2.2875 / $6.0000 | Buy Now |
Part Details for MAX3738ETG+T
MAX3738ETG+T CAD Models
MAX3738ETG+T Part Data Attributes
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MAX3738ETG+T
Analog Devices Inc
Buy Now
Datasheet
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Compare Parts:
MAX3738ETG+T
Analog Devices Inc
155Mbps to 4.25Gbps SFF/SFP Laser Driver with Extinction Ratio Control, 24-LFCSP-4X4X0.75, 24 Pins, -40 to 85C
Select a part to compare: |
| Rohs Code | Yes | |
| Part Life Cycle Code | Not Recommended | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | 24-LFCSP-4X4X0.75 | |
| Package Description | 4 X 4 MM, 0.80 MM HEIGHT, MO-220WGGD, QFN-24 | |
| Pin Count | 24 | |
| Manufacturer Package Code | 24-LFCSP-4X4X0.75 | |
| Reach Compliance Code | compliant | |
| Date Of Intro | 2004-02-09 | |
| Samacsys Manufacturer | Analog Devices | |
| Interface IC Type | INTERFACE CIRCUIT | |
| JESD-30 Code | S-XQCC-N24 | |
| JESD-609 Code | e3 | |
| Length | 4 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC24,.16SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.8 mm | |
| Supply Voltage-Max | 3.63 V | |
| Supply Voltage-Min | 2.97 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | BIPOLAR | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Matte Tin (Sn) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | QUAD | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 4 mm |
Alternate Parts for MAX3738ETG+T
This table gives cross-reference parts and alternative options found for MAX3738ETG+T. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MAX3738ETG+T, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Manufacturer | Composite Price | Description | Compare |
|---|---|---|---|---|
| MAX3668EHJ+ | Maxim Integrated Products | Check for Price | Interface Circuit, BIPolar, PQFP32, 5 X 5 MM, 1 MM HEIGHT, LEAD FREE, MS-026AAA-HD, TQFP-32 | MAX3738ETG+T vs MAX3668EHJ+ |
MAX3738ETG+T Frequently Asked Questions (FAQ)
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A good PCB layout for the MAX3738ETG+T involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a dedicated ground plane is recommended.
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To ensure proper power-up and power-down, the MAX3738ETG+T requires a controlled power supply sequence. The VCC pin should be powered up before the VEE pin, and the VEE pin should be powered down before the VCC pin. Additionally, the EN pin should be pulled high after VCC is stable.
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The MAX3738ETG+T can support data rates up to 3.2 Gbps, but the actual data rate achievable depends on the specific application, PCB layout, and signal integrity.
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To troubleshoot issues with the MAX3738ETG+T, use a combination of tools such as oscilloscopes, signal generators, and logic analyzers to analyze the signal waveforms and timing. Also, check the power supply voltage and current, and ensure that the device is properly powered up and powered down.
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Yes, the MAX3738ETG+T has a maximum junction temperature of 150°C. To ensure reliable operation, the device should be mounted on a PCB with a good thermal conductivity, and a heat sink may be required for high-power applications.