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Part Details for MAX3002EBP+ by Analog Devices Inc
Results Overview of MAX3002EBP+ by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Available)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Healthcare
MAX3002EBP+ Information
MAX3002EBP+ by Analog Devices Inc is an Other Interface IC.
Other Interface ICs are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for MAX3002EBP+
| Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | +1.2V to +5.5V, ±15kV ESD-Prot Package Multiple: 1 | 0 |
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Part Details for MAX3002EBP+
MAX3002EBP+ CAD Models
MAX3002EBP+ Part Data Attributes
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MAX3002EBP+
Analog Devices Inc
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Datasheet
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Compare Parts:
MAX3002EBP+
Analog Devices Inc
+1.2V to +5.5V, ±15kV ESD-Protected, 0.1µA, 35Mbps, 8-Channel Level Translators, N/A, 20 Pins, -40 to 85C
Select a part to compare: |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | N/A | |
| Pin Count | 20 | |
| Manufacturer Package Code | N/A | |
| Date Of Intro | 2002-11-29 | |
| Samacsys Manufacturer | Analog Devices | |
| Interface IC Type | INTERFACE CIRCUIT | |
| JESD-30 Code | R-PBGA-B20 | |
| JESD-609 Code | e1 | |
| Length | 2.54 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 20 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA20,4X5,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Seated Height-Max | 0.67 mm | |
| Supply Voltage-Max | 5.5 V | |
| Supply Voltage-Min | 1.2 V | |
| Supply Voltage1-Max | 5.5 V | |
| Supply Voltage1-Min | 1.65 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 2.03 mm |