Part Details for MAX13030EEBE+ by Analog Devices Inc
Results Overview of MAX13030EEBE+ by Analog Devices Inc
- Distributor Offerings: (1 listing)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
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MAX13030EEBE+ Information
MAX13030EEBE+ by Analog Devices Inc is an Other Interface IC.
Other Interface ICs are under the broader part category of Drivers And Interfaces.
A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.
Price & Stock for MAX13030EEBE+
| Part # | Distributor | Description | Stock | Price | Buy | |
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Analog Devices Inc | 6-Channel High-Speed Logic-Lev Package Multiple: 1 | 1560 |
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Part Details for MAX13030EEBE+
MAX13030EEBE+ CAD Models
MAX13030EEBE+ Part Data Attributes
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MAX13030EEBE+
Analog Devices Inc
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Datasheet
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MAX13030EEBE+
Analog Devices Inc
6-Channel High-Speed Logic-Level Translators, 16-WLCSP-N/A, 16 Pins, -40 to 85C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | ANALOG DEVICES INC | |
| Part Package Code | 16-WLCSP-N/A | |
| Package Description | 2 X 2 MM, LEAD FREE, UCSP-16 | |
| Pin Count | 16 | |
| Manufacturer Package Code | 16-WLCSP-N/A | |
| Reach Compliance Code | compliant | |
| Date Of Intro | 2007-02-12 | |
| Interface IC Type | INTERFACE CIRCUIT | |
| JESD-30 Code | S-PBGA-B16 | |
| JESD-609 Code | e1 | |
| Length | 2.02 mm | |
| Moisture Sensitivity Level | 1 | |
| Number of Functions | 1 | |
| Number of Terminals | 16 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | VFBGA | |
| Package Equivalence Code | BGA16,4X4,20 | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.67 mm | |
| Supply Voltage-Max | 3.2 V | |
| Supply Voltage-Min | 1.62 V | |
| Supply Voltage-Nom | 1.8 V | |
| Supply Voltage1-Max | 3.6 V | |
| Supply Voltage1-Min | 2.2 V | |
| Supply Voltage1-Nom | 3.3 V | |
| Surface Mount | YES | |
| Technology | BICMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Tin/Silver/Copper (Sn/Ag/Cu) | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 2.02 mm |