Part Details for M02066G-51 by MACOM
Overview of M02066G-51 by MACOM
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (0 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (0 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
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Applications
Internet of Things (IoT)
Environmental Monitoring
Financial Technology (Fintech)
Smart Cities
Transportation and Logistics
Energy and Power Systems
Agriculture Technology
Medical Imaging
Telecommunications
Virtual Reality (VR), Augmented Reality (AR), and Vision Systems
Education and Research
Consumer Electronics
Security and Surveillance
Audio and Video Systems
Computing and Data Storage
Healthcare
Entertainment and Gaming
Robotics and Drones
Part Details for M02066G-51
M02066G-51 CAD Models
M02066G-51 Part Data Attributes
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M02066G-51
MACOM
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Datasheet
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M02066G-51
MACOM
Interface Circuit, BCC-24
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| Pbfree Code | Yes | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Active | |
| Ihs Manufacturer | M/A-COM TECHNOLOGY SOLUTIONS INC | |
| Part Package Code | BCC | |
| Package Description | HVQCCN, | |
| Pin Count | 24 | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Interface IC Type | INTERFACE CIRCUIT | |
| JESD-30 Code | S-XBCC-N24 | |
| JESD-609 Code | e4 | |
| Length | 4 mm | |
| Moisture Sensitivity Level | 2 | |
| Number of Functions | 1 | |
| Number of Terminals | 24 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | UNSPECIFIED | |
| Package Code | HVQCCN | |
| Package Equivalence Code | LCC24,.16SQ,20 | |
| Package Shape | SQUARE | |
| Package Style | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | |
| Peak Reflow Temperature (Cel) | 260 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 0.8 mm | |
| Supply Voltage-Max | 3.63 V | |
| Supply Voltage-Min | 2.97 V | |
| Supply Voltage-Nom | 3.3 V | |
| Surface Mount | YES | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | Nickel/Palladium/Gold (Ni/Pd/Au) | |
| Terminal Form | NO LEAD | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Width | 4 mm |