Part Details for LTC2874IFE#PBF by Linear Technology
Overview of LTC2874IFE#PBF by Linear Technology
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Applications
Consumer Electronics
Security and Surveillance
Internet of Things (IoT)
Industrial Automation
Renewable Energy
Telecommunications
Entertainment and Gaming
Robotics and Drones
Part Details for LTC2874IFE#PBF
LTC2874IFE#PBF CAD Models
LTC2874IFE#PBF Part Data Attributes:
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LTC2874IFE#PBF
Linear Technology
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LTC2874IFE#PBF
Linear Technology
LTC2874 - Quad IO-Link Master Hot Swap Controller and PHY; Package: TSSOP; Pins: 38; Temperature Range: -40°C to 85°C
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| Rohs Code | Yes | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | LINEAR TECHNOLOGY CORP | |
| Part Package Code | TSSOP | |
| Package Description | TSSOP-38 | |
| Pin Count | 38 | |
| Manufacturer Package Code | FE | |
| Reach Compliance Code | compliant | |
| HTS Code | 8542.39.00.01 | |
| Interface IC Type | INTERFACE CIRCUIT | |
| Interface Standard | SPI | |
| JESD-30 Code | R-PDSO-G38 | |
| JESD-609 Code | e3 | |
| Length | 9.7 mm | |
| Number of Functions | 4 | |
| Number of Terminals | 38 | |
| Operating Temperature-Max | 85 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | HTSSOP | |
| Package Equivalence Code | TSSOP38,.25,20 | |
| Package Shape | RECTANGULAR | |
| Package Style | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | |
| Seated Height-Max | 1.2 mm | |
| Supply Voltage-Max | 34 V | |
| Supply Voltage-Min | 8 V | |
| Supply Voltage-Nom | 24 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Temperature Grade | INDUSTRIAL | |
| Terminal Finish | MATTE TIN | |
| Terminal Form | GULL WING | |
| Terminal Pitch | 0.5 mm | |
| Terminal Position | DUAL | |
| Width | 4.4 mm |