Part Details for LMX9830SMX by National Semiconductor Corporation
Overview of LMX9830SMX by National Semiconductor Corporation
- Distributor Offerings: (0 listings)
- Number of FFF Equivalents: (4 replacements)
- CAD Models: (Request Part)
- Number of Functional Equivalents: (4 options)
- Part Data Attributes: (Available)
- Reference Designs: (Not Available)
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Applications
Consumer Electronics
Computing and Data Storage
Available Datasheets
| Part # | Manufacturer | Description | Datasheet |
|---|---|---|---|
| LMX9830SMX/NOPB | Texas Instruments | Wireless MCU and Smart RF Transceiver Module 60-NFBGA -40 to 125 |
Part Details for LMX9830SMX
LMX9830SMX CAD Models
LMX9830SMX Part Data Attributes
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LMX9830SMX
National Semiconductor Corporation
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Datasheet
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LMX9830SMX
National Semiconductor Corporation
IC SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FBGA-60, Telecom IC:Other
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| Rohs Code | No | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | NATIONAL SEMICONDUCTOR CORP | |
| Package Description | 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FBGA-60 | |
| Reach Compliance Code | not_compliant | |
| HTS Code | 8542.39.00.01 | |
| JESD-30 Code | R-PBGA-B60 | |
| JESD-609 Code | e0 | |
| Length | 9 mm | |
| Moisture Sensitivity Level | 3 | |
| Number of Functions | 1 | |
| Number of Terminals | 60 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LFBGA | |
| Package Equivalence Code | BGA60,6X10,32 | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY, LOW PROFILE, FINE PITCH | |
| Peak Reflow Temperature (Cel) | 235 | |
| Qualification Status | Not Qualified | |
| Seated Height-Max | 1.3 mm | |
| Supply Current-Max | 0.065 mA | |
| Supply Voltage-Nom | 2.75 V | |
| Surface Mount | YES | |
| Technology | CMOS | |
| Telecom IC Type | TELECOM CIRCUIT | |
| Temperature Grade | AUTOMOTIVE | |
| Terminal Finish | TIN LEAD | |
| Terminal Form | BALL | |
| Terminal Pitch | 0.8 mm | |
| Terminal Position | BOTTOM | |
| Time@Peak Reflow Temperature-Max (s) | 30 | |
| Width | 6 mm |
Alternate Parts for LMX9830SMX
This table gives cross-reference parts and alternative options found for LMX9830SMX. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of LMX9830SMX, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
| Part Number | Description | Manufacturer | Compare |
|---|---|---|---|
| LMX9830SMX/NOPB | IC SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, FBGA-60, Telecom IC:Other | National Semiconductor Corporation | LMX9830SMX vs LMX9830SMX/NOPB |
| LMX9830SM/NOPB | IC SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, GREEN, PLASTIC, FBGA-60, Telecom IC:Other | National Semiconductor Corporation | LMX9830SMX vs LMX9830SM/NOPB |
| LMX9830SM | SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FBGA-60 | Texas Instruments | LMX9830SMX vs LMX9830SM |
| LMX9830SMX | SPECIALTY TELECOM CIRCUIT, PBGA60, 9 X 6 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, PLASTIC, FBGA-60 | Texas Instruments | LMX9830SMX vs LMX9830SMX |