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Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host Interface 25-DSBGA -40 to 85
Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Part # | Distributor | Description | Stock | Price | Buy | |
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DISTI #
2156-LM8328TME/NOPB-ND
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DigiKey | IC INTFACE SPECIALIZED 25DSBGA Min Qty: 1 Lead time: 12 Weeks Container: Bulk MARKETPLACE PRODUCT |
10250 In Stock |
|
$2.0200 | Buy Now |
DISTI #
296-LM8328TME/NOPBCT-ND
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DigiKey | IC INTFACE SPECIALIZED 25DSBGA Min Qty: 1 Lead time: 12 Weeks Container: Cut Tape (CT), Digi-Reel®, Tape & Reel (TR) |
250 In Stock |
|
$1.8766 / $3.7400 | Buy Now |
DISTI #
926-LM8328TME/NOPB
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Mouser Electronics | Interface - I/O Expanders Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host Interface 25-DSBGA -40 to 85 RoHS: Compliant | 0 |
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$1.8700 / $3.7400 | Order Now |
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Rochester Electronics | LM8328 Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host Interface RoHS: Compliant Status: Active Min Qty: 1 | 10250 |
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$1.7300 / $2.0400 | Buy Now |
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Ameya Holding Limited | IC MOBILE I/O COMPAN 25DSBGA | 5950 |
|
RFQ | |
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Chip1Cloud | IC MOBILE I/O COMPAN 25DSBGA | 6250 |
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RFQ |
By downloading CAD models, you agree to our Terms & Conditions and Privacy Policy
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LM8328TME/NOPB
Texas Instruments
Buy Now
Datasheet
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Compare Parts:
LM8328TME/NOPB
Texas Instruments
Mobile I/O Companion Supporting Keyscan, I/O Expansion, PWM, and ACCESS.bus Host Interface 25-DSBGA -40 to 85
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Pbfree Code | Yes | |
Rohs Code | Yes | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | TEXAS INSTRUMENTS INC | |
Part Package Code | BGA | |
Package Description | SMD-25 | |
Pin Count | 25 | |
Reach Compliance Code | compliant | |
ECCN Code | EAR99 | |
HTS Code | 8542.31.00.01 | |
Samacsys Manufacturer | Texas Instruments | |
Interface IC Type | INTERFACE CIRCUIT | |
JESD-30 Code | S-PBGA-B25 | |
JESD-609 Code | e1 | |
Length | 2.015 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 25 | |
Operating Temperature-Max | 85 °C | |
Operating Temperature-Min | -40 °C | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Qualification Status | Not Qualified | |
Seated Height-Max | 0.675 mm | |
Supply Voltage-Max | 1.98 V | |
Supply Voltage-Min | 1.62 V | |
Supply Voltage-Nom | 1.8 V | |
Surface Mount | YES | |
Temperature Grade | INDUSTRIAL | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.4 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 2.015 mm |