Part Details for LC898119XC-MH by onsemi
Overview of LC898119XC-MH by onsemi
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Applications
Consumer Electronics
Part Details for LC898119XC-MH
LC898119XC-MH CAD Models
LC898119XC-MH Part Data Attributes:
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LC898119XC-MH
onsemi
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Datasheet
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LC898119XC-MH
onsemi
Optical Image Stabilization (OIS) Controller & Driver, WLCSP25, 2.0x2.0, 4000-REEL
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Pbfree Code | Yes | |
Part Life Cycle Code | Lifetime Buy | |
Ihs Manufacturer | ON SEMICONDUCTOR | |
Package Description | VFBGA, | |
Manufacturer Package Code | 567HK | |
Reach Compliance Code | compliant | |
HTS Code | 8542.39.00.01 | |
Interface IC Type | INTERFACE CIRCUIT | |
JESD-30 Code | S-PBGA-B25 | |
JESD-609 Code | e1 | |
Length | 2 mm | |
Moisture Sensitivity Level | 1 | |
Number of Functions | 1 | |
Number of Terminals | 25 | |
Package Body Material | PLASTIC/EPOXY | |
Package Code | VFBGA | |
Package Shape | SQUARE | |
Package Style | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | |
Peak Reflow Temperature (Cel) | 260 | |
Seated Height-Max | 0.675 mm | |
Supply Voltage-Max | 3.6 V | |
Supply Voltage-Min | 2.6 V | |
Supply Voltage-Nom | 3 V | |
Supply Voltage1-Max | 3.6 V | |
Supply Voltage1-Min | 2.6 V | |
Surface Mount | YES | |
Technology | CMOS | |
Terminal Finish | TIN SILVER COPPER | |
Terminal Form | BALL | |
Terminal Pitch | 0.4 mm | |
Terminal Position | BOTTOM | |
Time@Peak Reflow Temperature-Max (s) | 30 | |
Width | 2 mm |