Datasheets
KXPC7441RX700LG by:

32-BIT, 700MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360

Part Details for KXPC7441RX700LG by Motorola Mobility LLC

Overview of KXPC7441RX700LG by Motorola Mobility LLC

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Applications Industrial Automation Renewable Energy Robotics and Drones

Part Details for KXPC7441RX700LG

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KXPC7441RX700LG Part Data Attributes:

KXPC7441RX700LG Motorola Mobility LLC
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KXPC7441RX700LG Motorola Mobility LLC 32-BIT, 700MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360
Part Life Cycle Code Transferred
Ihs Manufacturer MOTOROLA INC
Part Package Code BGA
Package Description BGA,
Pin Count 360
Reach Compliance Code unknown
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Address Bus Width 36
Bit Size 32
Boundary Scan YES
Clock Frequency-Max 133 MHz
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
JESD-30 Code S-CBGA-B360
Length 25 mm
Low Power Mode YES
Number of Terminals 360
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Qualification Status Not Qualified
Seated Height-Max 3.24 mm
Speed 700 MHz
Supply Voltage-Max 1.55 V
Supply Voltage-Min 1.45 V
Supply Voltage-Nom 1.5 V
Surface Mount YES
Technology CMOS
Terminal Form BALL
Terminal Pitch 1.27 mm
Terminal Position BOTTOM
Width 25 mm
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC

Alternate Parts for KXPC7441RX700LG

This table gives cross-reference parts and alternative options found for KXPC7441RX700LG. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of KXPC7441RX700LG, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Description Manufacturer Compare
XPC7441RX700LG 32-BIT, 700 MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Motorola Mobility LLC KXPC7441RX700LG vs XPC7441RX700LG
Part Number Description Manufacturer Compare
TSXPC750AMGSB/T10LH RISC Microprocessor, 32-Bit, 233MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation KXPC7441RX700LG vs TSXPC750AMGSB/T10LH
PPC7448VS1250ND 32-BIT, 1250MHz, RISC PROCESSOR, CLGA360 NXP Semiconductors KXPC7441RX700LG vs PPC7448VS1250ND
MPC7410THX500LE 32-BIT, 500MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, FCBGA-360 Freescale Semiconductor KXPC7441RX700LG vs MPC7410THX500LE
TSXC750AVGSU12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CGA-360 Thales Group KXPC7441RX700LG vs TSXC750AVGSU12LH
PC755VG350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation KXPC7441RX700LG vs PC755VG350LE
PC7448VLH1250ND RISC Microprocessor, 32-Bit, 1250MHz, CMOS, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, LGA-360 e2v technologies KXPC7441RX700LG vs PC7448VLH1250ND
MPC755CVT350 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360 Freescale Semiconductor KXPC7441RX700LG vs MPC755CVT350
PC7410VGSU400LE RISC Microprocessor, 32-Bit, 400MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, 4.20 MM HEIGHT, COLUMN INTERPOSER, CERAMIC, BGA-360 Atmel Corporation KXPC7441RX700LG vs PC7410VGSU400LE
TSXPC750AVGSU12LH RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation KXPC7441RX700LG vs TSXPC750AVGSU12LH
PC7448VGHY1250NC RISC Microprocessor, 1250MHz, CMOS, CBGA360, 25 X 25 MM, 2.80 MM HEIGHT, 1.27 MM PITCH, ROHS COMPLIANT, CERMIC, HITCE, BGA-360 e2v technologies KXPC7441RX700LG vs PC7448VGHY1250NC

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