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Microcontrollers and Processors Microprocessors MPC755CVT350

Microcontrollers and Processors
MPC755CVT350
Description: 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360

Overview of MPC755CVT350 by Freescale Semiconductor

Note: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.
Where used in Applications: Industrial Automation Healthcare Renewable Energy Robotics and Drones

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Part Data Attributes for MPC755CVT350 by Freescale Semiconductor
Parametric Data

MPC755CVT350
Freescale Semiconductor
Buy Now
-
-
Part Life Cycle Code
Transferred
Ihs Manufacturer
FREESCALE SEMICONDUCTOR INC
Part Package Code
BGA
Package Description
BGA,
Pin Count
360
Reach Compliance Code
unknown
ECCN Code
3A991.A.2
HTS Code
8542.31.00.01
Additional Feature
ALSO REQUIRES 2.5V OR 3.3V SUPPLY
Address Bus Width
32
Bit Size
32
Boundary Scan
YES
Clock Frequency-Max
100 MHz
External Data Bus Width
64
Format
FLOATING POINT
Integrated Cache
YES
JESD-30 Code
S-PBGA-B360
Length
25 mm
Low Power Mode
YES
Number of Terminals
360
Package Body Material
PLASTIC/EPOXY
Package Code
BGA
Package Shape
SQUARE
Package Style
GRID ARRAY
Qualification Status
Not Qualified
Seated Height-Max
2.77 mm
Speed
350 MHz
Supply Voltage-Max
2.1 V
Supply Voltage-Min
1.8 V
Supply Voltage-Nom
2 V
Surface Mount
YES
Technology
CMOS
Terminal Form
BALL
Terminal Pitch
1.27 mm
Terminal Position
BOTTOM
Width
25 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR, RISC
Want to compare parts?
  1. MPC755CVT350
    Freescale Semiconductor
    32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77MM HEIGHT, 1.27 MM PITCH, LEAD FREE, PLASTIC, BGA-360
    VS

Alternate Parts for MPC755CVT350

This table gives cross-reference parts and alternative options found for MPC755CVT350. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of MPC755CVT350, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.
Part Number Description Manufacturer Compare
IBM25PPC750L-DB0C350W RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM MPC755CVT350 vs IBM25PPC750L-DB0C350W
PC755MG350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation MPC755CVT350 vs PC755MG350LE
PC755BVZFU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Teledyne e2v MPC755CVT350 vs PC755BVZFU350LE
MPC755BPX350LE 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, PLASTIC, BGA-360 Motorola Mobility LLC MPC755CVT350 vs MPC755BPX350LE
PC755VGHU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Teledyne e2v MPC755CVT350 vs PC755VGHU350LE
PC755MGH350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, HITCE, CERAMIC, BGA-360 Atmel Corporation MPC755CVT350 vs PC755MGH350LE
PCX755BMZFU350LE RISC Microprocessor, 32-Bit, 350MHz, CMOS, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, FLIP CHIP, PLASTIC, BGA-360 Atmel Corporation MPC755CVT350 vs PCX755BMZFU350LE
IBM25PPC750L-EB0B350W RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM MPC755CVT350 vs IBM25PPC750L-EB0B350W
MPC755CVT350 32-BIT, 350MHz, RISC PROCESSOR, PBGA360 NXP Semiconductors MPC755CVT350 vs MPC755CVT350
IBM25PPC750L-DB0A350W RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM MPC755CVT350 vs IBM25PPC750L-DB0A350W
Part Number Description Manufacturer Compare
XPC755BPX350LD 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360 Freescale Semiconductor MPC755CVT350 vs XPC755BPX350LD
PC7400VGU350LX RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA360, 25 X 25 MM, 3.20 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Atmel Corporation MPC755CVT350 vs PC7400VGU350LX
PC7447VGU500NB RISC Microprocessor, 32-Bit, 500MHz, CMOS, CBGA360, 25 X 25 MM, 3.24 MM HEIGHT, 1.27 MM PITCH, CERAMIC, BGA-360 Teledyne e2v MPC755CVT350 vs PC7447VGU500NB
PPC7448HX667NC 32-BIT, 667MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor MPC755CVT350 vs PPC7448HX667NC
PCX7448MLH1000ND RISC Microprocessor, 32-Bit, 1000MHz, CMOS, CBGA360, 25 X 25 MM, 1.80 MM HEIGHT, 1.27 MM PITCH, CERAMIC, HITCE, LGA-360 Teledyne e2v MPC755CVT350 vs PCX7448MLH1000ND
PPC7448HX1250NC 32-BIT, 1250MHz, RISC PROCESSOR, CBGA360, 25 X 25 MM, 2.20 MM HEIGHT, 1.27 MM PITCH, HCTE, CERAMIC, BGA-360 Freescale Semiconductor MPC755CVT350 vs PPC7448HX1250NC
PCX7448VSH1267ND RISC Microprocessor, 32-Bit, 1267MHz, CMOS, CBGA360, 25 X 25 MM, 2.40 MM HEIGHT, 1.27 MM PITCH, CERAMIC, ROHS COMPLIANT, BGA-360 Teledyne e2v MPC755CVT350 vs PCX7448VSH1267ND
IBM25EMPPC750LFBE3000 RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA360, 25 X 25 MM, 1.27 MM PITCH, CERAMIC, BGA-360 IBM MPC755CVT350 vs IBM25EMPPC750LFBE3000
TSPC750AVGB/Q12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, CERAMIC, BGA-360 Thales Group MPC755CVT350 vs TSPC750AVGB/Q12LE
TSXPC750AMGSB/T12LE RISC Microprocessor, 32-Bit, 266MHz, CMOS, CBGA360, COLUMN INTERPOSER, CERAMIC, CGA-360 Atmel Corporation MPC755CVT350 vs TSXPC750AMGSB/T12LE

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