Datasheets
IXDN604SIATR by:
IXYS Integrated Circuits Division
IXYS Corporation
IXYS Integrated Circuits Division
Littelfuse Inc
Not Found

Buffer/Inverter Based MOSFET Driver, 4A, PDSO8, ROHS COMPLIANT, SOIC-8

Part Details for IXDN604SIATR by IXYS Integrated Circuits Division

Results Overview of IXDN604SIATR by IXYS Integrated Circuits Division

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Applications Automotive

IXDN604SIATR Information

IXDN604SIATR by IXYS Integrated Circuits Division is an MOSFET Driver.
MOSFET Drivers are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Price & Stock for IXDN604SIATR

Part # Distributor Description Stock Price Buy
Win Source Electronics 4-Ampere Dual Low-Side Ultrafast MOSFET Drivers | IC GATE DVR 4A DUAL HS 8SOIC 13200
  • 40 $1.4013
  • 90 $1.1498
  • 135 $1.1139
  • 190 $1.0780
  • 240 $1.0420
  • 325 $0.9342
$0.9342 / $1.4013 Buy Now

Part Details for IXDN604SIATR

IXDN604SIATR CAD Models

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IXDN604SIATR Part Data Attributes

IXDN604SIATR IXYS Integrated Circuits Division
Buy Now Datasheet
Compare Parts:
IXDN604SIATR IXYS Integrated Circuits Division Buffer/Inverter Based MOSFET Driver, 4A, PDSO8, ROHS COMPLIANT, SOIC-8
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Pbfree Code Yes
Rohs Code Yes
Part Life Cycle Code Transferred
Ihs Manufacturer IXYS INTEGRATED CIRCUITS DIVISION
Part Package Code SOIC
Package Description SOIC-8
Pin Count 8
Reach Compliance Code compliant
ECCN Code EAR99
HTS Code 8542.39.00.01
High Side Driver NO
Interface IC Type BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER
JESD-30 Code R-PDSO-G8
Length 4.928 mm
Moisture Sensitivity Level 1
Number of Functions 2
Number of Terminals 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Peak Current Limit-Nom 4 A
Package Body Material PLASTIC/EPOXY
Package Code LSOP
Package Equivalence Code SOP8,.25
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, LOW PROFILE
Seated Height-Max 1.676 mm
Supply Current-Max 0.01 mA
Supply Voltage-Max 35 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 18 V
Surface Mount YES
Temperature Grade AUTOMOTIVE
Terminal Finish PURE MATTE TIN
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Turn-off Time 0.065 µs
Turn-on Time 0.065 µs
Width 3.937 mm

Alternate Parts for IXDN604SIATR

This table gives cross-reference parts and alternative options found for IXDN604SIATR. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IXDN604SIATR, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
IXDN604SIATR Littelfuse Inc $0.8857 Buffer/Inverter Based MOSFET Driver, PDSO8, SOIC-8 IXDN604SIATR vs IXDN604SIATR
Part Number Manufacturer Composite Price Description Compare
IXDN604SIA IXYS Corporation $1.2809 Buffer/Inverter Based MOSFET Driver, PDSO8, SOIC-8 IXDN604SIATR vs IXDN604SIA
IXDN604SIA IXYS Integrated Circuits Division Check for Price Buffer/Inverter Based MOSFET Driver, 4A, PDSO8, ROHS COMPLIANT, SOIC-8 IXDN604SIATR vs IXDN604SIA
IXDN604SIATR IXYS Corporation Check for Price Buffer/Inverter Based MOSFET Driver, PDSO8, SOIC-8 IXDN604SIATR vs IXDN604SIATR
IXDN604SIA Littelfuse Inc Check for Price Buffer/Inverter Based MOSFET Driver, PDSO8, SOIC-8 IXDN604SIATR vs IXDN604SIA

IXDN604SIATR Related Parts

IXDN604SIATR Frequently Asked Questions (FAQ)

  • The maximum operating temperature range for the IXDN604SIATR is -40°C to 150°C.

  • To ensure proper biasing, follow the recommended voltage and current ratings in the datasheet, and consider using a voltage regulator or current limiter to prevent overheating or damage.

  • For optimal thermal performance, use a multi-layer PCB with thermal vias, and consider using a heat sink or thermal interface material to dissipate heat. Follow the recommended PCB layout guidelines in the datasheet or application notes.

  • Handle the device with ESD-protective equipment, such as wrist straps or mats, and ensure the PCB is designed with ESD protection in mind, including using ESD-protection diodes or resistors.

  • Use a soldering iron with a temperature range of 200°C to 250°C, and follow the recommended soldering profile in the datasheet or application notes. For rework, use a hot air rework station or a soldering iron with a fine tip.