Datasheets
IXDI614SI by:
IXYS Integrated Circuits Division
IXYS Corporation
IXYS Integrated Circuits Division
Littelfuse Inc
Not Found

IC BUF OR INV BASED MOSFET DRIVER, PDSO8, ROHS COMPLIANT, MS-012BA, SOIC-8, MOSFET Driver

Part Details for IXDI614SI by IXYS Integrated Circuits Division

Results Overview of IXDI614SI by IXYS Integrated Circuits Division

Tip: Data for a part may vary between manufacturers. You can filter for manufacturers on the top of the page next to the part image and part number.

Applications Industrial Automation Automotive Motor control systems

IXDI614SI Information

IXDI614SI by IXYS Integrated Circuits Division is an MOSFET Driver.
MOSFET Drivers are under the broader part category of Drivers And Interfaces.

A driver controls the current or voltage delivered to components like LCDs or motors, while an interface component connects systems for data transfer and control. Read more about Drivers And Interfaces on our Drivers And Interfaces part category page.

Part Details for IXDI614SI

IXDI614SI CAD Models

There are no models available for this part yet.

Sign in to request this CAD model.

Register or Sign In

IXDI614SI Part Data Attributes

IXDI614SI IXYS Integrated Circuits Division
Buy Now Datasheet
Compare Parts:
IXDI614SI IXYS Integrated Circuits Division IC BUF OR INV BASED MOSFET DRIVER, PDSO8, ROHS COMPLIANT, MS-012BA, SOIC-8, MOSFET Driver
Select a part to compare:
Part Life Cycle Code Transferred
Ihs Manufacturer IXYS INTEGRATED CIRCUITS DIVISION
Part Package Code SOIC
Package Description HSOP, SOP8,.24
Pin Count 8
Reach Compliance Code unknown
ECCN Code EAR99
HTS Code 8542.39.00.01
High Side Driver NO
Interface IC Type BUFFER OR INVERTER BASED MOSFET DRIVER
JESD-30 Code R-PDSO-G8
Length 4.9 mm
Number of Functions 1
Number of Terminals 8
Operating Temperature-Max 125 °C
Operating Temperature-Min -40 °C
Output Polarity TRUE
Package Body Material PLASTIC/EPOXY
Package Code HSOP
Package Equivalence Code SOP8,.24
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, HEAT SINK/SLUG
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Seated Height-Max 1.75 mm
Supply Current-Max 3 mA
Supply Voltage-Max 35 V
Supply Voltage-Min 4.5 V
Supply Voltage-Nom 18 V
Surface Mount YES
Temperature Grade AUTOMOTIVE
Terminal Form GULL WING
Terminal Pitch 1.27 mm
Terminal Position DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Turn-off Time 0.075 µs
Turn-on Time 0.075 µs
Width 3.9 mm

Alternate Parts for IXDI614SI

This table gives cross-reference parts and alternative options found for IXDI614SI. The Form Fit Function (FFF) tab will give you the options that are more likely to serve as direct pin-to-pin alternates or drop-in parts. The Functional Equivalents tab will give you options that are likely to match the same function of IXDI614SI, but it may not fit your design. Always verify details of parts you are evaluating, as these parts are offered as suggestions for what you are looking for and are not guaranteed.

Part Number Manufacturer Composite Price Description Compare
IXDI614SITR IXYS Integrated Circuits Division Check for Price IC BUF OR INV BASED MOSFET DRIVER, PDSO8, ROHS COMPLIANT, MS-012BA, SOIC-8, MOSFET Driver IXDI614SI vs IXDI614SITR
IXDI614SI IXYS Corporation Check for Price Buffer/Inverter Based MOSFET Driver, PDSO8, SOIC-8 IXDI614SI vs IXDI614SI

IXDI614SI Related Parts

IXDI614SI Frequently Asked Questions (FAQ)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat. Multiple vias can be used to connect the thermal pad to an internal or bottom-side copper plane.

  • Ensure that the device is operated within the recommended junction temperature range (TJ) of -40°C to 150°C. Use a heat sink or thermal interface material to reduce thermal resistance. Monitor the device's thermal performance and adjust the system design as needed.

  • The IXDI614SI has an internal ESD protection diode, but it is recommended to add external ESD protection devices (e.g., TVS diodes) to protect the device from electrostatic discharge events.

  • The IXDI614SI is a commercial-grade device, but it can be used in high-reliability applications with proper derating and qualification. Consult with IXYS Corporation for specific requirements and testing protocols.

  • Use a systematic approach to troubleshoot issues: 1) Verify the device is properly soldered and connected, 2) Check the input and output voltage levels, 3) Verify the device is operating within the recommended temperature range, and 4) Consult the datasheet and application notes for specific guidance.